TE Connectivity 840-AG11D-LF

IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

CONN, IC SOCKET, DIP,40,OPEN,800 SERIES, SOLDER,0.6",0.1" PIN SPCNG, STRAIGHT,3A

Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Box/Tube

DIP Socket; Connector Type:DIP Socket; No. of Contacts:40; Contact Material:Beryllium Copper; Contact Plating:Gold; Pitch Spacing:0.1"; Series:800; Row Spacing:0.6"; Socket Mounting:Through Hole; Leaded Process Compatible:Yes ;RoHS Compliant: Yes

SOCKET IC, DIL, 0.6", 40WAY; Connector Type:DIP; Series:800; No. of Contacts:40; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Contact Termination:Through Hole Vertical; Contact Material:Beryllium Copper; Contact Plating:Gold; Capacitance:1pF; Connector Mounting Orientation:PC Board; Connector Type:DIP; Contact Current Max:3A; Contact Material:Beryllium Copper; Contact Plating:Gold; Contact Resistance:10mohm; Contact Shell Plating:Tin / Lead; Contact Type:Turned Pin; Current Rating:3A; De-mating Force:63gf; Dielectric Strength VAC:1kV; External Width:17.78mm; Flammability Rating:UL94V-0; Height Above Pcb Max:4.57mm; Insulation Resistance:5000Mohm; Insulator Material:Thermoplastic polyester; Lead Spacing:2.54mm; Length:50.80mm; Material:beryllium copper contacts; Mating Force:134gf; Mounting Type:PC Board; No. of Ways:40; Operating Temperature Max:125°C; Operating Temperature Min:-55°C; PCB Hole Diameter:0.89mm; Package / Case:DIL; Pin Format:DIP; Shell Contact Material:Brass