NXP Semiconductors MK50DN512CMD10
$ 11.68
Production
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
1 part available
CAD Models
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Alternate Parts
This Part
Alternate Parts
Price @ 1000
$ 11.68
$ 12.439
Stock
179,088
71,691
Authorized Distributors
6
3
Case/Package
MAPBGA
MAPBGA
Number of Pins
144
144
Core Architecture
ARM
ARM
Data Bus Width
32 b
-
Max Frequency
32 MHz
32 MHz
Number of I/Os
93
93
Interface
I2S
I2S
Memory Type
FLASH
FLASH
Memory Size
512 kB
512 kB
Min Supply Voltage
1.71 V
1.71 V
Max Supply Voltage
3.6 V
3.6 V
Peripherals
DMA, LVD, POR, PWM, WDT
DMA, LVD, POR, PWM, WDT
Supply Chain
Country of OriginMainland China, Malaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2012-06-07
Lifecycle StatusProduction (Last Updated: 3 weeks ago)
Related Parts
NXP SemiconductorsMK10DN512VMD10
Kinetis K10: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, 144-MAPBGA
NXP SemiconductorsMK60DN512ZVMD10
MCU 32-bit K60 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
NXP SemiconductorsMK60DN512VMD10
MCU 32-bit K60 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
Descriptions
Descriptions of NXP Semiconductors MK50DN512CMD10 provided by its distributors.
MCU 32-bit K50 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 100MHz, CMOS, PBGA144
Kinetis K50: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 144-MAPBGA
Product Range:kinetis Arm Cortex-M4 Microcontrollers; Architecture:arm Cortex-M4; No. Of Bits:32Bit; Cpu Speed:100Mhz; Program Memory Size:512Kb; Ram Memory Size:128Kb; No. Of Pins:144Pins; Mcu Case Style:mapbga; No. Of I/o S:96I/o Srohs Compliant: Yes
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
1 part available
Technical Specifications
Physical
Case/PackageMAPBGA
MountSurface Mount
Number of Pins144
Number of Terminals144
Weight441.005182 mg
Technical
ADC Channels (Resolution)41-Ch 16-Bit
Core ArchitectureARM
DAC Channels (Resolution)2-Ch 12-Bit
Data Bus Width32 b
EEPROM Memory Size0 B
Frequency100 MHz
InterfaceI2S
Max Frequency32 MHz
Max Operating Temperature85 °C
Max Supply Current77 mA
Max Supply Voltage3.6 V
Memory Size512 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.71 V
Number of ADC Channels2
Number of I2C Channels2
Number of I/Os93
Number of PWM Channels12
Number of SPI Channels3
Number of Timers/Counters8
Number of UART Channels6
Number of USB Channels1
Operating Supply Voltage3.3 V
Oscillator TypeInternal
PeripheralsDMA, LVD, POR, PWM, WDT
RAM Size128 kB
Schedule B8542310000
Temperature GradeIndustrial
Dimensions
Height1.7 mm
Height - Seated (Max)1.7 mm
Length13 mm
Terminal Pitch1 mm
Width13 mm
Compliance
Environmental Classification
China RoHSCompliant
Lead FreeLead Free
REACH SVHCYes
RoHSCompliant
Compliance Statements