Winbond W949D6DBHX5I

R-PBGA-B60 Surface Mount Tray 32MX16 ic memory 200MHz 5ns 8mm 536870912bit
$ 8.063
Production

Price and Stock

Datasheets & Documents

Download datasheets and manufacturer documentation for Winbond W949D6DBHX5I.

IHS

Datasheet59 pages8 years ago

SHENGYU ELECTRONICS

Inventory History

3 month trend:
Restocked

Alternate Parts

Price @ 1000
$ 8.063
$ 8.842
Stock
123,581
131,381
Authorized Distributors
2
1
Case/Package
TFBGA
TFBGA
Number of Pins
-
-
Memory Type
LPDDR, RAM, SDRAM
LPDDR, RAM, SDRAM
Density
-
-
Address Bus Width
-
-
Access Time
5 ns
5 ns
Frequency
200 MHz
200 MHz
Interface
Parallel
Parallel
Min Supply Voltage
1.7 V
1.7 V
Max Supply Voltage
1.95 V
1.95 V

Supply Chain

Lifecycle StatusProduction (Last Updated: 5 months ago)

Related Parts

64M, 3.3v, SDRAM, 4Mx16, 200 Mhz, 54 ball BGA (8mmx8mm) RoHS
DRAM Chip DDR SDRAM 256Mbit 16M X 16 2.5V 60-Pin TFBGA Tray
IC DRAM 64M PARALLEL 54TFBGA / 1 Meg Bits x 16 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM

Descriptions

Descriptions of Winbond W949D6DBHX5I provided by its distributors.

R-PBGA-B60 Surface Mount Tray 32MX16 ic memory 200MHz 5ns 8mm 536870912bit
DRAM Chip Mobile LPDDR SDRAM 512Mbit 32Mx16 1.8V 60-Pin VFBGA
Winbond SDRAM, 512Mbit, VFBGA, 16Bit, 64M x 8 bit, 200MHz, 60
LPDDR1 DRAM, 32MX16, 5ns, CMOS, PBGA60
DRAM 512Mb LPDDR, x16, 200MHz, Industrial Temp, 46nm
IC DRAM 512MBIT PARALLEL 60VFBGA
VFBGA60 512MB LP DDR X16 200MH

Manufacturer Aliases

Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:

  • Winbond Electronics
  • ISD
  • WIN
  • WINBON
  • WINBOND ELECTRONICS CORP
  • Winbond Electronics Corporation
  • WINB
  • WINDBOND
  • WINDOND
  • INFORMATION STORAGE DEVICES
  • Winbond Elec
  • WINBND
  • WINBOD
  • WinbondPb
  • WINBOND/PBF
  • WINBOND ELECTRO
  • WINBOUND
  • Winbond Electronics Corporation America
  • WINBOND Semiconductor
  • WINBONDELE
  • WINBNDELEC
  • WINBOND ELECT CORP
  • WINBOn semiD
  • WINBONB
  • Winbond Corp