NXP Semiconductors MC68EN360ZQ25L
Obsolete
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
1 part available
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors MC68EN360ZQ25L.
Alternate Parts
This Part
Alternate Parts
Price @ 1000
$ 104.074
Stock
114,978
146,086
Authorized Distributors
1
2
Case/Package
BGA
BGA
Number of Pins
357
357
Core Architecture
Coldfire
Coldfire
Data Bus Width
32 b
32 b
Max Frequency
6 MHz
6 MHz
Number of I/Os
46
46
Interface
Ethernet, Parallel, Serial, UART
Ethernet, Parallel, Serial, UART
Memory Type
-
-
Memory Size
-
-
Min Supply Voltage
4.75 V
4.75 V
Max Supply Voltage
5.25 V
5.25 V
Peripherals
-
-
Supply Chain
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2007-06-05
Lifecycle StatusObsolete (Last Updated: 2 weeks ago)
Related Parts
NXP SemiconductorsMC68360VR25L
MPU ColdFire M683xx Processor RISC 32-Bit 0.57um 25MHz 357-Pin BGA Tray
NXP SemiconductorsMC68MH360VR25VL
QUAD INTEGRATED COMMUNICATION CONTROLLER Serial I/O Controller, 1.25MBps, CMOS, PBGA357
NXP SemiconductorsMC68360ZQ25VL
MPU ColdFire M683xx Processor RISC 32-Bit 0.57um 25MHz 357-Pin BGA Tray
Descriptions
Descriptions of NXP Semiconductors MC68EN360ZQ25L provided by its distributors.
MPU ColdFire M683xx Processor RISC 32bit 0.57um 25MHz 357-Pin BGA Tray
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25)
MPU M68000 RISC 32-Bit HCMOS 25MHz 357-Pin BGA Tray
RISC Microcontroller, CMOS, PBGA357
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
1 part available
Technical Specifications
Physical
Case/PackageBGA
MountSurface Mount
Number of Pins357
Number of Terminals357
Weight2.1737 g
Technical
Core ArchitectureColdfire
Data Bus Width32 b
Frequency25 MHz
InterfaceEthernet, Parallel, Serial, UART
Max Frequency6 MHz
Max Operating Temperature70 °C
Max Supply Voltage5.25 V
Min Operating Temperature0 °C
Min Supply Voltage4.75 V
Number of Cores1
Number of I/Os46
Operating Supply Voltage5 V
RAM Size2.5 kB
Temperature GradeCommercial
Dimensions
Height - Seated (Max)1.86 mm
Length25 mm
Terminal Pitch1.27 mm
Width25 mm
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors MC68EN360ZQ25L.
Compliance
Environmental Classification
Halogen FreeNot Halogen Free
REACH SVHCNo
RoHSNon-Compliant
Compliance Statements