NXP Semiconductors MKE02Z64VLD4
$ 2.06
Production
Inventory History
3 month trend: -12.92%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
CAD Models
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Supply Chain
Country of OriginMainland China, Malaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2014-02-25
Lifecycle StatusProduction (Last Updated: 3 weeks ago)
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Descriptions
Descriptions of NXP Semiconductors MKE02Z64VLD4 provided by its distributors.
Kinetis KE02: 40MHz Cortex-M0+ 5V/Robust MCU, 64KB Flash, 4KB SRAM, 44-LQFP
MCU 8-bit Kinetis KE02 ARM Cortex M0+ CISC 64KB Flash 3.3V/5V 44-Pin LQFP Tray
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M0 CPU, 40MHz, CMOS, PQFP44
Kinetis KE02 Series 64 kB Flash 4 kB RAM SMT 32-Bit Microcontroller - LQFP-44
LQFP-44(10x10) Microcontroller Units (MCUs/MPUs/SOCs) ROHS
MCU, 32BIT, CORTEX-M0+, 40MHZ, LQFP-44; Product Range: KinetisE Family KE0x Series Microcontrollers; Architecture: ARM Cortex-M0+; No. of Bits: 32bit; CPU Speed: 40MHz; Program Memory Size: 64KB; RAM Memory Size: 4KB; No. of
Device Core = ARM® Cortex® M0+ / Data Bus Width bit = 32 / Instruction Set Architecture = RISC / Family Name = Kinetis / Clock Frequency Max. MHz = 40 / Program Memory Type = Flash / Program Memory Size KB = 64 / RAM Memory Size KB = 4 / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / ADC Channels = 16 / ADC Resolution bit = 16 / DAC Resolution bit = 6 / Number of Programmable I/Os = 37 / Number of Timers/Counters = 5 / Comparators = 2 / Supply Voltage Min. V = 2.7 / Supply Voltage Max. V = 5.5 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LQFP / Pins = 44 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 10 / Width mm = 10 / Height mm = 1.4 / Reflow Temperature Max. °C = 260
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: -12.92%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageLQFP
Contact PlatingTin
MountSurface Mount
Number of Pins44
Number of Terminals44
Technical
ADC Channels (Resolution)12-Ch 12-Bit, 16-Ch 12-Bit
Core ArchitectureARM
Data Bus Width32 b
EEPROM Memory Size256 B
Frequency40 MHz
InterfaceI2C
Max Frequency20 MHz
Max Operating Temperature105 °C
Max Supply Current120 mA
Max Supply Voltage5.5 V
Memory Size64 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Number of ADC Channels16
Number of I2C Channels1
Number of I/Os3
Number of Programmable I/O37
Number of SPI Channels2
Number of Timers/Counters12
Number of UART Channels3
Operating Supply Voltage3 V
Oscillator TypeInternal
PackagingCut Tape
PeripheralsPOR, WDT
RAM Size4 kB
Schedule B8542310000
Temperature GradeIndustrial
Watchdog TimerYes
Dimensions
Height1.4 mm
Height - Seated (Max)1.6 mm
Length10 mm
Terminal Pitch800 µm
Width10 mm
Compliance
Environmental Classification
China RoHSCompliant
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance Statements