NXP Semiconductors MK40DN512ZVMD10
$ 12.797
NRND
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Supply Chain
Country of OriginMainland China, Malaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.25
Introduction Date2011-05-13
Lifecycle StatusNRND (Last Updated: 3 weeks ago)
Related Parts
NXP SemiconductorsPK40N512VMD100
MCU 32-Bit/64-Bit K40 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
NXP SemiconductorsMK60DN512ZVMD10
MCU 32-bit K60 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
NXP SemiconductorsMK60DN512VMD10
MCU 32-bit K60 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
Descriptions
Descriptions of NXP Semiconductors MK40DN512ZVMD10 provided by its distributors.
MCU 32-bit K40 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 100MHz, CMOS, PBGA144
Kinetis K40: 100MHz Cortex-M4 MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, Segment LCD, 144-MAPBGA
IC 32BIT MCU KINETIS K40 100MHZ 144-MAPBGA; Controller Family/Series:(ARM Cortex - M4) Kinetis K40; Core Size:32bit; Program Memory Size:512 KB; CPU Speed:100MHz; Oscillator Type:External, Internal; Digital IC Case Style:MAPBGA ;RoHS Compliant: Yes
MCU, 32 BIT, KINETIS, K40, 144MAP; Controller Family/Series:(ARM Cortex - M4) Kinetis K40; Core Size:32bit; No. of I/O's:98; Supply Voltage Range:1.71V to 3.6V; Digital IC Case Style:MAPBGA; No. of Pins:144; Program Memory Size:512KB; RAM Memory Size:128KB; CPU Speed:100MHz; Oscillator Type:Internal; No. of Timers:2; Peripherals:ADC, Comparator, DMA, LCD Driver, RTC; Embedded Interface Type:CAN, I2C, I2S, SPI, UART, USB; Operating Temperature Range:-40°C to +105°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012)
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins144
Number of Terminals144
Weight441.005182 mg
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency100 MHz
InterfaceCAN, EBI/EMI, I2C, I2S, IrDA, SD, SPI, UART, USART, USB
Max Frequency32 MHz
Max Operating Temperature105 °C
Max Supply Voltage3.6 V
Memory Size512 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.71 V
Number of ADC Channels46
Number of I2C Channels2
Number of I/Os100
Number of PWM Channels8
Number of SPI Channels3
Number of Timers/Counters14
Number of UART Channels6
Number of USB Channels1
Operating Supply Voltage3.3 V
Oscillator TypeInternal
PeripheralsDMA, I2C, LCD, LVD, POR, PWM, WDT
RAM Size128 kB
Temperature GradeIndustrial
Watchdog TimerYes
Dimensions
Height1.18 mm
Height - Seated (Max)1.7 mm
Length13 mm
Terminal Pitch500 µm
Width13 mm
Compliance
Environmental Classification
China RoHSCompliant
Halogen FreeHalogen Free
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance Statements