Future Electronics Thermal Management

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Results: 1,176
Wakefield-Vette
511-6U
$ 34.021
Heat Sinks High Fin Density Heat Sink, IGBTs, Relays, Non-Mill, 132.33x152.4mm
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Heat Sinks maxiFLOW BGA Heat Sink, Thermal Tape, Blue-Anodized, T412, 27x27x17.5mm
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Wakefield-Vette
392-180AB
$ 108.626
Black Anodized 180 x 124.99 mm Press Fit Top Mount Heatsink Extrusion IGBT/SSR
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547 Series 36.8 x 57.9 x 11.4 mm 2.1°C/W Thermal Resistance Vertical Heatsink
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Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 14.6mm Height, Aluminum
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BUD CABLE GLAND_IP66 0.51-0.71 Item Number : IPG-22221-G
Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Tin Plate, TO220, 12.7x26.2x10.21mm
Heat Sinks BGA Heat Sink, Square Fin, 2 Side Thermal Tape, Black, 21x21x9.5mm
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Wakefield-Vette
510-6M
$ 65.139
Heat Sink Power Modules Aluminum Top Mount, Extrusion 7.38 inches W 6.0 inches L
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