Integrated Circuits (ICs)
Passive Components
Tools and Supplies
Series Specs
Contact Material | Phosphor Bronse | |
Contact Resistance | 10 mOhm | |
Insulation Material | Black Liquid Crystal Polymer | |
Lead Free Status | Lead Free | |
Number Of Mating Cycles | 100 | |
Operating Temperature | -55 to 125 degC | |
Rohs | Compliant | |
Voltage Rating Ac | 240 V | |
Voltage Rating Dc | 340 V |
Part Number Structure
Series
CLP
-1
Number Of Pins Per Row
10
-02-
Contact Plating
G
-
Number Of Rows
D
-
Other Option 1
BE
-
Other Option 2
A
-
Other Option 3
K
-
Packaging
TR
Select All | ||
Series | CLP Low Profile Dual Wipe Socket | |
Unknown0 | -1 | |
Number Of Pins Per Row | 10 | |
Unknown1 | -02- | |
Contact Plating | 10 µ" (0.25 µm) Gold | |
Hyphen0 | - | |
Number Of Rows | 2 | |
Hyphen1 | - | |
Other Option 1 | Bottom Entry | |
Hyphen2 | - | |
Other Option 2 | Alignment Pin | |
Hyphen3 | - | |
Other Option 3 | Polyimide Film Pick & Place Pad | |
Hyphen4 | - | |
Packaging | Tape and Reel | |