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Descriptions
Descriptions of Winbond W63AH2NBVABE provided by its distributors.
LPDDR3 DRAM, 32MX32, CMOS, PBGA178
VFBGA178 1GB LP DDR3 X32 800MH
IC DRAM 1GBIT HSUL 12 178VFBGA
LPDDR3 1Gbit 32M x 32 800MHz
DRAM 1Gb LPDDR3, x32, 800MHz
LPDDR3 DRAM Chip
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Number of Terminals178
Technical
Max Frequency800 MHz
Max Operating Temperature85 °C
Max Supply Current36 mA
Max Supply Voltage1.3 V
Min Operating Temperature-25 °C
Min Supply Voltage1.14 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.2 V
Dimensions
Height - Seated (Max)1 mm
Length11.5 mm
Terminal Pitch800 µm
Width11 mm