Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.36
Introduction Date2017-05-24
Lifecycle StatusEOL (Last Updated: 2 months ago)
LTB Date2020-07-01
LTD Date2020-10-01
Descriptions
Descriptions of Winbond W632GU6MB-11 provided by its distributors.
DDR3L DRAM, 128MX16, CMOS, PBGA96
IC DRAM 2GBIT PARALLEL 96VFBGA
IC DRAM 2G PARALLEL 933MHZ
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Number of Terminals96
Technical
Max Operating Temperature85 °C
Max Supply Voltage1.45 V
Min Operating Temperature0 °C
Min Supply Voltage1.283 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.35 V
Dimensions
Height - Seated (Max)1 mm
Length13 mm
Terminal Pitch800 µm
Width7.5 mm