Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.32
Introduction Date2017-12-01
Lifecycle StatusObsolete (Last Updated: 1 year ago)
LTB Date2021-03-29
LTD Date2021-06-28
Descriptions
Descriptions of Winbond W631GU8MB09I provided by its distributors.
IC MCU 32BIT 256KB FLASH 100LQFP
DDR3L DRAM, 128MX8, CMOS, PBGA78
IC SDRAM 1GB X8 1066MHZ 78WBGA
IC DRAM 1GBIT SSTL 15 78VFBGA
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Number of Terminals78
Technical
Max Operating Temperature95 °C
Max Supply Voltage1.45 V
Min Operating Temperature-40 °C
Min Supply Voltage1.283 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.35 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length10.5 mm
Terminal Pitch800 µm
Width8 mm