Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date1998-09-14
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2007-09-30
LTD Date2007-12-31
Descriptions
Descriptions of Winbond W27C257-10 provided by its distributors.
EEPROM, 32KX8, 100ns, Parallel, CMOS, PDIP28
WINBOND DIP28
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Case/PackageDIP
Number of Terminals28
Technical
Access Time100 ns
InterfaceParallel
Max Operating Temperature70 °C
Max Supply Voltage5.25 V
Memory TypeEEPROM
Min Operating Temperature0 °C
Min Supply Voltage4.75 V
Number of Circuits1
Operating Supply Voltage5 V
Temperature GradeCommercial
Dimensions
Height - Seated (Max)5.33 mm
Length37.08 mm
Terminal Pitch2.54 mm
Width15.24 mm