Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2002-04-11
Lifecycle StatusObsolete (Last Updated: 6 months ago)
LTB Date2007-09-30
LTD Date2007-12-31
Descriptions
Descriptions of Winbond W27C02-70 provided by its distributors.
EEPROM Parallel 2M-bit 256K x 8 5V 32-Pin PDIP
EEPROM, 256KX8, 70ns, Parallel, CMOS, PDIP32
WINBOND DIP-32
WINDOND DIP32
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Case/PackageDIP
Number of Terminals32
Technical
Access Time70 ns
InterfaceParallel
Max Operating Temperature70 °C
Max Supply Current30 mA
Max Supply Voltage5.5 V
Memory TypeEEPROM
Min Operating Temperature0 °C
Min Supply Voltage4.5 V
Number of Circuits1
Operating Supply Voltage5 V
Temperature GradeCommercial
Dimensions
Height - Seated (Max)5.33 mm
Length41.91 mm
Terminal Pitch2.54 mm
Width15.24 mm