Inventory History
3 month trend: -100%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
CAD Models
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Descriptions
Descriptions of Winbond W25Q01JVZEIM provided by its distributors.
IC FLASH 1GBIT SPI/QUAD 8WSON
32BIT MCU RX660 1MB LFQFP64 -40/
1Gb Serial SpiFlash (Dual Die) Dual/Quad
SPIFLASH, 1G-BIT, 4KB UNIFORM SE
WSON8 SPIFLASH 512MB 4KB US DT
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Inventory History
3 month trend: -100%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Number of Terminals8
Technical
Access Time7.5 ns
Ambient Temperature Range High85 °C
Frequency133 MHz
InterfaceSerial
Max Frequency133 MHz
Max Operating Temperature85 °C
Max Supply Current100 mA
Max Supply Voltage3.6 V
Memory Size128 MB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Number of Circuits1
Operating Supply Voltage3 V
Schedule B8542320070
Dimensions
Height800 µm
Height - Seated (Max)800 µm
Length8 mm
Terminal Pitch1.27 mm
Width6 mm