not recommended for new design Features: MOS input (voltage controlled) N channel, homgeneous Si Low inductance case Very low tail current with low temperature dependence High short circuit capability, self limiting to 6 x I cnom Latch-up free Fast & soft CAL diodes Isolated copper baseplate using DBC Direct Copper Bonding Technology Large clearance (12 mm) and creepage distances (20 mm) Typical Applications: AC inverter drives UPS