NXP Semiconductors MK61FX512VMJ15
$ 15.84
Production
Inventory History
3 month trend: +892%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
CAD Models
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Supply Chain
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2012-03-01
Lifecycle StatusProduction (Last Updated: 3 weeks ago)
Related Parts
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NXP SemiconductorsMK70FX512VMJ12
MCU 32-bit K70 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 256-Pin MAP-BGA Tray
NXP SemiconductorsMK61FN1M0VMJ15
MCU 32-bit Kinetis K61 ARM Cortex M4 RISC 1024KB Flash 1.8V/2.5V/3.3V 256-Pin MAP-BGA Tray
Descriptions
Descriptions of NXP Semiconductors MK61FX512VMJ15 provided by its distributors.
MCU 32-bit Kinetis K61 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 256-Pin MAP-BGA Tray
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 150MHz, CMOS, PBGA256
Kinetis K61: 150MHz M4F MCU, 512KB Flash + 512KB FlexMem, 128KB RAM, 2xUSB, ETH, Anti-tamper, 256BGA
Kinetis K61 Series 512 kB Flash 128 kB RAM SMT 32-Bit Microcontroller-MAPBGA-256
KINETIS K 32-BIT MCU, ARM CORTEX-M4 CORE, 512KB FLASH, 150MH
IC 32BIT MCU KINETIS K60 150MHZ 256-MAPBGA; Controller Family/Series:(ARM Cortex - M4) Kinetis K60; Core Size:32bit; Digital IC Case Style:MAPBGA; No. of Pins:256; Program Memory Size:512 KB; RAM Memory Size:128KB; CPU Speed:150MHz ;RoHS Compliant: Yes
Device Core = ARM® Cortex® M4 / Data Bus Width Bit = 32 / Instruction Set Architecture = RISC / Family Name = Kinetis / Clock Frequency Max. MHz = 150 / Program Memory Type = Flash / Program Memory Size KB = 512 / RAM Memory Size KB = 128 / Interfaces = Ethernet / Interfaces = USB / Interfaces = CAN / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / Interfaces = I²S / Interfaces = SDHC / ADC Resolution Bit = 16 / DAC Resolution Bit = 12 / Number of Programmable I/Os = 128 / Number of Timers/Counters = 10 / Comparators = 4 / Supply Voltage Min. V = 1.71 / Supply Voltage Max. V = 3.6 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LBGA / Pins = 256 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 17 / Width mm = 17 / Height mm = 1.7 / Reflow Temperature Max. °C = 260
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: +892%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageBGA
Number of Pins256
Number of Terminals256
Weight1.077707 g
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency150 MHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, IrDA, SPI, UART, USART, USB
Max Frequency60 MHz
Max Operating Temperature105 °C
Max Supply Current210 mA
Max Supply Voltage3.6 V
Memory Size512 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.71 V
Number of ADC Channels4
Number of Ethernet Channels1
Number of I2C Channels2
Number of I/Os128
Number of PWM Channels10
Number of SPI Channels3
Number of Timers/Counters11
Number of UART Channels6
Number of USB Channels2
Operating Supply Voltage3.3 V
Oscillator TypeInternal
PackagingCut Tape
PeripheralsDMA, LVD, POR, PWM, WDT
RAM Size128 kB
Schedule B8542310000
Temperature GradeIndustrial
Dimensions
Height1.7 mm
Length17 mm
Terminal Pitch1 mm
Width17 mm
Compliance
Environmental Classification
China RoHSCompliant
Halogen FreeHalogen Free
Lead FreeLead Free
REACH SVHCYes
RoHSCompliant
Compliance Statements