NXP Semiconductors MK60DN512VMC10
$ 10.509
Production
Inventory History
3 month trend: -0.76%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors MK60DN512VMC10.
CAD Models
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Supply Chain
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2012-06-07
Lifecycle StatusProduction (Last Updated: 2 weeks ago)
Related Parts
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MCU 32-bit K20 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 121-Pin MAP-BGA Tray
NXP SemiconductorsMK20DN512VMC10
MCU 32-bit Kinetis K20 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 121-Pin MAP-BGA Tray
NXP SemiconductorsMK51DN512ZCMC10
MCU 32-bit K51 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 121-Pin MAP-BGA Tray
Descriptions
Descriptions of NXP Semiconductors MK60DN512VMC10 provided by its distributors.
MCU 32-bit K60 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 121-Pin MAP-BGA Tray
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 100MHz, CMOS, PBGA121
Kinetis K60: 100MHz Cortex-M4 MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, Ethernet, 121-MAPBGA
KINETIS K 32-BIT MCU, ARM CORTEX-M4 CORE, 512KB FLASH, 100MH
MCU, CORTEX M4, KINETIS, 121MPBGA; Controller Family/Series:(ARM Cortex - M4) Kinetis K60; Core Size:32bit; No. of I/O's:100; Supply Voltage Min:1.71V; Supply Voltage Max:3.6V; Digital IC Case Style:MAPBGA; No. of Pins:121; Program Memory Size:512KB; RAM Memory Size:128KB; CPU Speed:100MHz; Peripherals:ADC, Comparator, DAC, DMA, PWM, Timer; Embedded Interface Type:CAN, Ethernet, I2C, I2S, SPI, UART, USB; Operating Temperature Min:-40°C; Operating Temperature Max:105°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013); Operating Temperature Range:-40°C to +105°C; Program Memory Size:512KB
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: -0.76%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins121
Number of Terminals121
Weight167.687429 mg
Technical
ADC Channels (Resolution)38-Ch 16-Bit
Core ArchitectureARM
DAC Channels (Resolution)2-Ch 12-Bit
Data Bus Width32 b
EEPROM Memory Size0 B
Frequency100 MHz
InterfaceI2S
Max Frequency32 MHz
Max Operating Temperature105 °C
Max Supply Current77 mA
Max Supply Voltage3.6 V
Memory Size512 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.71 V
Number of I/Os81
Number of Programmable I/O86
Number of Timers/Counters9
Operating Supply Voltage3.3 V
Oscillator TypeInternal
PeripheralsDMA, I2C, LVD, POR, PWM, WDT
RAM Size128 kB
Schedule B8542310000
Temperature GradeIndustrial
Watchdog TimerYes
Dimensions
Height - Seated (Max)1.52 mm
Length8 mm
Terminal Pitch650 µm
Width8 mm
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors MK60DN512VMC10.
Compliance
Environmental Classification
China RoHSCompliant
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance Statements