NXP Semiconductors MCIMX6U7CVM08AB
$ 45.156
NRND
Inventory History
3 month trend: -46.32%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
CAD Models
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Supply Chain
Export Control Classification Number (ECCN) Code5A992
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2012-11-12
Lifecycle StatusNRND (Last Updated: 2 weeks ago)
Related Parts
NXP SemiconductorsMCIMX6S7CVM08AC
Microprocessor, ARM Cortex-A9, i.MX 6Solo Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
NXP SemiconductorsMCIMX6S6AVM08AC
Microprocessor, ARM Cortex-A9, i.MX 6Solo Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
NXP SemiconductorsMCIMX6S7CVM08AB
Microprocessor, ARM Cortex-A9, i.MX 6Solo Series, 800 MHz, 32bit, 1.275 V to 1.5 V, MAPBGA-624
Descriptions
Descriptions of NXP Semiconductors MCIMX6U7CVM08AB provided by its distributors.
Microprocessor, ARM Cortex-A9, i.MX 6DualLite Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
I.mx 6 Series 32-Bit Mpu, Dual Arm Cortex-A9 Core, 800Mhz, Mapbga 624 Rohs Compliant: Yes
RISC Microprocessor, 32-Bit, 800MHz, CMOS, PBGA624
FLOATING POINT MICROPROCESSOR RISC USB 2.0 + PHY (4) BALL IC Microprocessor -40C~105C TA 21mm 1.275V 800MHz
SOC i.MX 6DualLite ARM Cortex-A9 0.04um 624-Pin MAP-BGA Tray
IC MPU I.MX6DL 800MHZ 624MAPBGA
IC MPU 32BIT ROMLESS 624MAPBGA
Microprocessors - MPU i.MX6 DualLite
Processors - Application Specialized i.MX6 DualLite
MPU, CORTEX A9, IMX6Q, 624 MAP
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: -46.32%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageLFBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins624
Number of Terminals624
Weight1.25251 g
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency800 MHz
InterfaceCAN, Ethernet, I2C, I2S, PCIe, SPI, UART, USB
Max Frequency800 MHz
Max Operating Temperature105 °C
Max Supply Current2.2 A
Max Supply Voltage1.5 V
Memory Size96 kB
Memory TypeL2 Cache, ROM, ROMless, SRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.275 V
Number of Cores2
Number of Ethernet Channels1
Number of I2C Channels4
Number of PWM Channels4
Number of SPI Channels4
Number of Timers/Counters2
Number of UART Channels5
Number of USB Channels4
RAM Size128 kB
Temperature GradeIndustrial
Dimensions
Height1.3 mm
Height - Seated (Max)1.5 mm
Length21 mm
Terminal Pitch800 µm
Width21 mm
Compliance
Environmental Classification
China RoHSCompliant
Halogen FreeHalogen Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance Statements