NXP Semiconductors MCIMX357CVM5B
$ 29.125
Production
Inventory History
3 month trend: +0.00%
CAD Models
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Alternate Parts
0 parts available
CAD Models
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Supply Chain
Export Control Classification Number (ECCN) Code5A002.A
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2009-04-30
Lifecycle StatusProduction (Last Updated: 2 weeks ago)
Descriptions
Descriptions of NXP Semiconductors MCIMX357CVM5B provided by its distributors.
i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400
MPU, IMX35, MEDIA APPS PROC, MAPBGA
IC MPU I.MX35 532MHZ 400MAPBGA
Applications Processor 400-Pin MAPBGA Tray
USB 2.0 + PHY (2) 532MHz ROM 1 1.33V 1.47V 532MHz 16KB 1.8V,2V,2.5V,2.7V,3V,3.3V 1 Wire,ASRC,ATA,CAN,I2C,I2S,MMC,SAI,SDIO,SPI,SSI,UART 10Mbps,100Mbps 32bit ARM1136JF-S ;GPU,IPU,VFP BGA 17mm*17mm*1.18mm
MPU, IMX35, MEDIA APPS PROC, MAPBGA; Series:i.MX35; Core Size:32bit; Program Memory Size:32 KB; CPU Speed:532MHz; Digital IC Case Style:MAPBGA; No. of Pins:400; Supply Voltage Range:1.22V to 1.47V; Operating Temperature Range:-40°C to +85°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2011); Cache on Chip L1/L2 Memory:160KB; Frequency Typ:532MHz; Interface Type:1-Wire, CAN, I2C, I2S, JTAG, SPI, SSI, UART, USB; Package / Case:MAPBGA; Supply Voltage Max:1.47V; Supply Voltage Min:1.33V; Termination Type:SMD
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins400
Number of Terminals400
Weight838.692292 mg
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency532 MHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB
Max Frequency532 MHz
Max Operating Temperature85 °C
Max Supply Voltage1.47 V
Memory Size32 kB
Memory TypeL2 Cache, ROM, ROMless, SRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.22 V
Number of I/Os96
Operating Supply Voltage1.8 V
Oscillator TypeExternal
PeripheralsDMA, LCD, POR, PWM, WDT
RAM Size128 kB
Temperature GradeIndustrial
TerminationSMD/SMT
Dimensions
Height - Seated (Max)1.6 mm
Length17 mm
Terminal Pitch800 µm
Width17 mm
Compliance
Environmental Classification
China RoHSCompliant
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance Statements