NXP Semiconductors LPC845M301JHI33Y
$ 1.168
Production
Inventory History
3 month trend: -1.09%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors LPC845M301JHI33Y.
CAD Models
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Supply Chain
Country of OriginTaiwan
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.25
Introduction Date2018-02-27
Lifecycle StatusProduction (Last Updated: 3 months ago)
Descriptions
Descriptions of NXP Semiconductors LPC845M301JHI33Y provided by its distributors.
MCU 32-Bit LPC845 ARM Cortex-M0+ RISC 64KB Flash 1.8V to 3.6V 32-Pin HVQFN T/R
ARM Microcontrollers - MCU LPC845M301JHI33/HVQFN32/REEL 13" Q1/T1 *STANDARD MARK SMD DP
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M0 CPU, 30MHz, CMOS, PQCC33
Low-Cost Microcontrollers (Mcus) Based On Arm Cortex M0+ Cores /Reel Rohs Compliant: Yes |NXP Semiconductors LPC845M301JHI33Y
NXP - LPC845M301JHI33Y - ARM MCU, LPC Family LPC800 Series Microcontrollers, ARM Cortex-M0+, 32bit, 30 MHz, 64 KB, 16 KB
MCU, 32BIT, 30MHZ, HVQFN-33; Product Range: LPC Family LPC800 Series Microcontrollers; Architecture: ARM Cortex-M0+; No. of Bits: 32bit; CPU Speed: 30MHz; Program Memory Size: 64KB; RAM Memory Size: 16KB; No. of Pins: 33Pins; M
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: -1.09%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Number of Terminals33
Technical
ADC Channels (Resolution)12-Ch 12-Bit
Ambient Temperature Range High105 °C
Core ArchitectureARM Cortex-M0+
DAC Channels (Resolution)1-Ch 10-Bit
Data Bus Width32 b
EEPROM Memory Size0 B
Frequency30 MHz
InterfaceI2C, SPI, UART, USART
Max Frequency25 MHz
Max Junction Temperature (Tj)150 °C
Max Operating Temperature105 °C
Max Supply Voltage3.6 V
Memory Size64 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.8 V
Number of A/D Converters1
Number of ADC Channels12
Number of I2C Channels4
Number of I/Os5
Number of Interrupts8
Number of PWM Channels5
Number of SPI Channels2
Number of Timers/Counters8
Number of UART Channels5
Operating Supply Voltage3.3 V
RAM Size16 kB
Dimensions
Height1 mm
Height - Seated (Max)850 µm
Length5 mm
Terminal Pitch500 µm
Width5 mm
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors LPC845M301JHI33Y.