AMD XCKU3P-L1FFVD900I
$ 2,223.45
Production
Supply Chain
Country of OriginTaiwan
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2016-06-03
Lifecycle StatusProduction (Last Updated: 1 month ago)
Descriptions
Descriptions of AMD XCKU3P-L1FFVD900I provided by its distributors.
Kintex UltraScale FPGA, Speed Grade-L1, Logic Cells 356K, D900, RoHS
Xilinx SCT
IC FPGA 304 I/O 900FCBGA / Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 31641600 355950 900-BBGA, FCBGA
Kintex UltraScale FPGA 355950 System Logic Cells 325440 Registers 12.7Mb RAM 304 I/O Surface Mount 900-Pin FPBGA Tray
FPGA, KINTEX ULTRASCALE+, FCBGA-900
Fpga, Kintex Ultrascale+, Fcbga-900; Svhc:No Svhc (15-Jan-2019) Rohs Compliant: Yes |Amd Xilinx XCKU3P-L1FFVD900I
Manufacturer Aliases
AMD has several brands around the world that distributors may use as alternate names. AMD may also be known as the following names:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Technical Specifications
Physical
Case/PackageBGA
Number of Terminals900
Technical
Max Operating Temperature100 °C
Max Supply Voltage742 mV
Min Operating Temperature-40 °C
Min Supply Voltage698 mV
Number of Inputs304
Number of Logic Blocks (LABs)20340
Number of Logic Elements/Cells355950
Number of Outputs304
Number of Transceivers0
Operating Supply Voltage720 mV
RAM Size1.7 MB
Speed Grade-L1
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)3.42 mm
Length31 mm
Terminal Pitch1 mm
Width31 mm