NXP Semiconductors MCIMX6Q5EYM10AC

I.mx 6 Series 32-Bit Mpu, Quad Arm Cortex-A9 Core, 1Ghz, Fcbga 624 Rohs Compliant: Yes

Technical Specifications

Physical
Case/PackageFCBGA
Contact PlatingCopper, Silver, Tin
Number of Pins624
Weight1.287097 g
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency1 GHz
InterfaceI2C, PCIe, SPI, UART, USB
Max Frequency1 GHz
Max I/O Voltage36 V
Max Operating Temperature105 °C
Max Supply Voltage3.6 V
Memory TypeL2 Cache, ROM, SRAM
Min Operating Temperature-20 °C
Min Supply Voltage1.65 V
Number of Cores4
RAM Size256 kB
Schedule B8542310000
Speed Grade1 GHz
Dimensions
Height2 mm
Length21 mm
Width21 mm

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MCIMX6Q5EYM10AC.

NXP Semiconductors SCT
Datasheet170 pages8 years ago
Freescale Semiconductor
Datasheet169 pages11 years ago
Technical Drawing2 pages12 years ago
element14 APAC
Datasheet170 pages11 years ago
Future Electronics
Datasheet174 pages11 years ago
Newark
Datasheet168 pages11 years ago
Farnell
Datasheet3 pages10 years ago
Datasheet3 pages11 years ago

Inventory History

3 month trend:
+69.51%

Engineering Resources

View Evaluation kits and Reference designs for NXP Semiconductors MCIMX6Q5EYM10AC.

Related Parts

Descriptions

Descriptions of NXP Semiconductors MCIMX6Q5EYM10AC provided by its distributors.

I.mx 6 Series 32-Bit Mpu, Quad Arm Cortex-A9 Core, 1Ghz, Fcbga 624 Rohs Compliant: Yes
MPUi.MX 6Solo RISC 32-Bit 1000MHz 1.2V/1.5V/1.35V 624-Pin MAPBGA Tray
MPU, I.MX6 QUAD, 1GHZ, 624FCBGA; Core Size:32bit; Supply Voltage Min:1.65V; Supply Voltage Max:3.6V; Digital IC Case Style:FCBGA; No. of Pins:624; Program Memory Size:-; CPU Speed:1GHz; Embedded Interface Type:CAN, I2C, JTAG, SPI, SSI, UART, USB; Operating Temperature Range:-20°C to +105°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2012); Series:i.MX6; Supply Voltage Range:1.65V to 3.6V

Manufacturer Aliases

NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:

  • NXP
  • PHILIPS
  • PHIL
  • PHI
  • PHILLIPS
  • NXP USA Inc
  • NXP SEMI
  • NXP SEMICONDUCTOR
  • PHILIPS/NXP
  • PHILIPS SEMICONDUCTORS
  • PHILIP
  • Philips Semiconductor
  • NXP/PHILIPS
  • PHILPS
  • PHILIPS COMPONENTS
  • PHILIPS SEMI
  • PHL
  • PHLIPS
  • NXP Semicon
  • PHILIPS ECG
  • NXP / Freescale
  • PHILL
  • Philips Semiconducto
  • PHILLIP
  • PHILI
  • Philips Semiconductors
  • NXP Semiconductors NV
  • NXP

Part Number Aliases

This part may be known by these alternate part numbers:

  • MCIMX6Q5EYM10AC.

Technical Specifications

Physical
Case/PackageFCBGA
Contact PlatingCopper, Silver, Tin
Number of Pins624
Weight1.287097 g
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency1 GHz
InterfaceI2C, PCIe, SPI, UART, USB
Max Frequency1 GHz
Max I/O Voltage36 V
Max Operating Temperature105 °C
Max Supply Voltage3.6 V
Memory TypeL2 Cache, ROM, SRAM
Min Operating Temperature-20 °C
Min Supply Voltage1.65 V
Number of Cores4
RAM Size256 kB
Schedule B8542310000
Speed Grade1 GHz
Dimensions
Height2 mm
Length21 mm
Width21 mm

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MCIMX6Q5EYM10AC.

NXP Semiconductors SCT
Datasheet170 pages8 years ago
Freescale Semiconductor
Datasheet169 pages11 years ago
Technical Drawing2 pages12 years ago
element14 APAC
Datasheet170 pages11 years ago
Future Electronics
Datasheet174 pages11 years ago
Newark
Datasheet168 pages11 years ago
Farnell
Datasheet3 pages10 years ago
Datasheet3 pages11 years ago

Compliance

Environmental Classification
Halogen FreeHalogen Free
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCNo SVHC
RoHSCompliant
Compliance Statements
Materials Sheet5 pages9 years ago
Rohs Statement1 page11 years ago
Reach Statement3 pages11 years ago
Conflict Mineral Statement1 page10 years ago
Rohs Statement1 page12 years ago
Reach Statement2 pages8 years ago