NXP Semiconductors MPC8309CVMADDCA
$ 22.02
Obsolete
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
1 part available
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors MPC8309CVMADDCA.
Alternate Parts
This Part
Alternate Parts
Price @ 1000
$ 22.02
$ 22.96
Stock
569,921
99,761
Authorized Distributors
3
2
Case/Package
LFBGA
LFBGA
Number of Pins
489
489
Core Architecture
-
-
Data Bus Width
32 b
32 b
Max Frequency
66.67 MHz
66.67 MHz
Interface
-
-
Min Supply Voltage
950 mV
950 mV
Max Supply Voltage
1.05 V
1.05 V
Supply Chain
Country of OriginMainland China
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2011-08-18
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2023-03-30
LTD Date2024-06-30
Related Parts
NXP SemiconductorsMPC8309VMADDCA
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MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 0.09um 333MHz 1.8V/3.3V 489-Pin MAP-BGA Tray
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MPU PowerQUICC II Pro MPC83xx Processor RISC 32-Bit 0.09um 266MHz 1V/1.8V/2.5V/3.3V 516-Pin TEBGA Tray
Descriptions
Descriptions of NXP Semiconductors MPC8309CVMADDCA provided by its distributors.
MPU MPC83xx RISC 32-Bit 0.09um 266MHz 1.8V/3.3V 489-Pin MAPBGA Tray
RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA489
USB 2.0 (1) 266MHz L1 CACHE 1 950mV 1.05V 266MHz 16KB 1.8V,3.3V CAN,DUART,I2C,MMC,SD,SPI,TDM 10Mbps,100Mbps 32bit PowerPC e300c3 ;QUICC BGA 19mm*19mm*1.27mm
MPU Core = e300 / Data Bus Width Bit = 32 / Family Name = PowerQUICC / Cores = 1 / Clock Frequency Max. MHz = 266 / Interfaces = USB / Interfaces = Ethernet / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / Interfaces = PCI / Interfaces = SDHC / Interfaces = TDM / L1 Cache Instruction Memory KB = 16 / L1 Cache Data Memory KB = 16 / Number of Timers/Counters = 10 / I/O Voltage V = 3.3 / Supply Voltage Min. mV = 950 / Supply Voltage Max. V = 1.05 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LFBGA / Pins = 489 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 19 / Width mm = 19 / Height mm = 1.61 / Reflow Temperature Max. °C = 260
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
1 part available
Technical Specifications
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins489
Number of Terminals489
Weight1.035211 g
Technical
Data Bus Width32 b
Frequency266 MHz
Max Frequency66.67 MHz
Max Operating Temperature105 °C
Max Supply Voltage1.05 V
Memory Size16 kB
Min Operating Temperature-40 °C
Min Supply Voltage950 mV
Number of Cores1
Operating Supply Voltage1 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.61 mm
Length19 mm
Terminal Pitch800 µm
Width19 mm
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors MPC8309CVMADDCA.
Compliance
Environmental Classification
Halogen FreeHalogen Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance Statements