Winbond W971GG8SB-25
Obsolete
Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.32
Introduction Date2015-01-13
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2021-06-17
LTD Date2021-09-17
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Descriptions
Descriptions of Winbond W971GG8SB-25 provided by its distributors.
DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V 60-Pin WBGA
DDR2 DRAM, 128MX8, 0.4ns, CMOS, PBGA60
IC DRAM 1GBIT PARALLEL 60WBGA
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Case/PackageTFBGA
Number of Terminals60
Technical
Access Time400 ps
InterfaceParallel
Max Operating Temperature85 °C
Max Supply Voltage1.9 V
Memory TypeDDR2 SDRAM, RAM
Min Operating Temperature0 °C
Min Supply Voltage1.7 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Schedule B8542320015
Dimensions
Height - Seated (Max)1.2 mm
Length12.5 mm
Terminal Pitch800 µm
Width8 mm