STMicroelectronics STGB30H60DLFB

HB Series 600 V 60 A 260 W Surface Mount Trench Gate Field-Stop IGBT - D2PAK-3
$ 1.66
Obsolete
制造商页面数据表

价格与库存

查看所有价格优惠
DistributorSKUMinPkg
Farnell
2
STGB30H60DLFB7221Cut Tape
1d
element14 APAC
2
STGB30H60DLFB7221Cut Tape
32m
Mouser511-STGB30H60DLFB8111Tape & Reel
Win SourceWS-STGB30H60DLFB2016
13h
Worldway ElectronicsSTGB30H60DLFB29,3837Tape & Reel
12h

数据表和文档

下载 STMicroelectronics STGB30H60DLFB 的数据表和制造商文档。

IHS

Datasheet20 页13 年前

库存历史记录

3 个月趋势:
-1.54%
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备用零件

此零件
备用零件
STMicroelectronicsSTGB30H60DLFB
STMicroelectronicsSTGB30H60DFB
Price @ 1000
$ 1.66
$ 1.076
Stock
116,275
300,052
Authorized Distributors
3
6
Mount
Surface Mount
Surface Mount
Case/Package
TO-263-3
TO-263-3
Collector Emitter Breakdown Voltage
600 V
600 V
Max Collector Current
60 A
60 A
Power Dissipation
-
-
Collector Emitter Saturation Voltage
1.55 V
1.55 V
Reverse Recovery Time
-
53 ns

供应链

Country of OriginMainland China
Export Control Classification Number (ECCN) CodeEAR99
Introduction Date2014-07-23
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2022-10-29
LTD Date2023-04-29

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描述

由其分销商提供的 STMicroelectronics STGB30H60DLFB 的描述。

HB Series 600 V 60 A 260 W Surface Mount Trench Gate Field-Stop IGBT - D2PAK-3
Future Electronics
Trans IGBT Chip N-CH 600V 60A 260000mW 3-Pin(2+Tab) D2PAK T/R
Verical
Trench gate field-stop IGBT, HB series 600 V, 30 A high speed
STMicroelectronics

图片

Farnell
Lanka Micro
Future Electronics

制造商别名

STMicroelectronics 在全球拥有多个品牌，分销商可将其用作替代名称。STMicroelectronics 也可称为以下名称：

  • ST MICRO
  • STM
  • SGS
  • SGS THOMSON
  • INMOS
  • STMICROE
  • STMICROEL
  • STMICR
  • ST MIC
  • ST MICROELECTRONIC
  • SGS THOMPSON
  • SESCOSEM
  • STMICROELECT
  • ST8
  • STMICROELECTRON
  • WAFERSCALE
  • SGS-ATES
  • ST MICROELECTRONICS SEMI
  • ST/SGS
  • ST MICROELECTRO
  • SGST
  • THOMS
  • STMICROELE
  • WAFERSCALE INTEGRATION INC
  • SGS-Thomson Microelectronics
  • ST Microeletronics

零件编号别名

该零件可能有以下备用零件编号：

  • STGB30H60DLFB.