AMD XC3S4000-4FGG900C
Obsolete
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Supply Chain
Country of OriginTaiwan
Export Control Classification Number (ECCN) Code3A991.D
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date1997-09-17
Lifecycle StatusObsolete (Last Updated: 1 month ago)
LTB Date2024-06-29
LTD Date2024-12-28
Related Parts
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Lattice SemiconductorLFE2-70E-5FN900C
LATTICE SEMICONDUCTOR LFE2-70E-5FN900C FPGA, 68K LUTS, 583 I/O, DSP, 900FPBGA
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Lattice SemiconductorLFE3-70EA-7FN1156C
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Descriptions
Descriptions of AMD XC3S4000-4FGG900C provided by its distributors.
FPGA Spartan-3 Family 4M Gates 62208 Cells 630MHz 90nm Technology 1.2V 900-Pin F-BGA
Field Programmable Gate Array, 6912 CLBs, 4000000 Gates, 630MHz, 62208-Cell, CMOS, PBGA900
Xc3S4000-4Fgg900C Rohs Compliant: Yes |Amd Xilinx XC3S4000-4FGG900C
216KB 62208 6912 1.14V 1.26V BGA 31mm*31mm*2.6mm
CONN MOD JACK 8P8C VERT UNSHLD
Manufacturer Aliases
AMD has several brands around the world that distributors may use as alternate names. AMD may also be known as the following names:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Technical Specifications
Physical
Case/PackageBGA
MountSurface Mount
Number of Pins900
Number of Terminals900
Technical
Max Frequency630 MHz
Max Operating Temperature85 °C
Max Supply Voltage1.26 V
Min Operating Temperature0 °C
Min Supply Voltage1.14 V
Number of Gates4e+06
Number of I/Os633
Number of Inputs633
Number of Logic Blocks (LABs)6912
Number of Logic Elements/Cells62208
Number of Outputs633
Operating Supply Voltage1.2 V
RAM Size216 kB
Speed Grade4
Dimensions
Height - Seated (Max)2.6 mm
Length31 mm
Terminal Pitch1 mm
Width31 mm