AMD XC3S2000-4FGG900C
Obsolete
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Supply Chain
Country of OriginTaiwan
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date1997-09-17
Lifecycle StatusObsolete (Last Updated: 1 month ago)
LTB Date2024-06-29
LTD Date2024-12-28
Related Parts
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Lattice SemiconductorLFE2M50E-5FN900C
FPGA LatticeECP2M Family 48000 Cells 90nm Technology 1.2V 900-Pin FBGA
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FPGA Spartan-3A DSP Family 1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V 676-Pin FBGA
Descriptions
Descriptions of AMD XC3S2000-4FGG900C provided by its distributors.
FPGA Spartan-3 Family 2M Gates 46080 Cells 630MHz 90nm Technology 1.2V 900-Pin F-BGA
Field Programmable Gate Array, 5120 CLBs, 2000000 Gates, 630MHz, 46080-Cell, CMOS, PBGA900
720Kbit 46080 5120 1.14V 1.26V BGA 31mm*31mm*2.6mm
IC FPGA 565 I/O 900FBGA
Manufacturer Aliases
AMD has several brands around the world that distributors may use as alternate names. AMD may also be known as the following names:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Technical Specifications
Physical
Case/PackageBGA
MountSurface Mount
Number of Pins900
Number of Terminals900
Technical
Max Frequency630 MHz
Max Operating Temperature85 °C
Max Supply Voltage1.26 V
Min Operating Temperature0 °C
Min Supply Voltage1.14 V
Number of Gates2e+06
Number of I/Os565
Number of Inputs565
Number of Logic Blocks (LABs)5120
Number of Logic Elements/Cells46080
Number of Outputs565
Operating Supply Voltage1.2 V
RAM Size90 kB
Speed Grade4
Dimensions
Height - Seated (Max)2.6 mm
Length31 mm
Terminal Pitch1 mm
Width31 mm