Texas Instruments OMAP3530ECUS72
$ 56.688
Production
Inventory History
3 month trend: +0.00%
CAD Models
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Alternate Parts
0 parts available
CAD Models
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Supply Chain
Lifecycle StatusProduction (Last Updated: 6 days ago)
Manufacturer Lifecycle StatusACTIVE (Last Updated: 6 days ago)
Engineering Resources
View Evaluation kits and Reference designs for Texas Instruments OMAP3530ECUS72.
Evaluation Kit
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Descriptions
Descriptions of Texas Instruments OMAP3530ECUS72 provided by its distributors.
DSP Fixed-Point 16Bit 520MHz/720MHz 1440MIPS 473-Pin FC-BGA Tray
SOC OMAP3 ARM Cortex A8 65nm 423-Pin BGA Tray
Applications Processor 423-FCCSP 0 to 90
IC MPU OMAP-35XX 720MHZ 423FCBGA
OMAP 3 ARCH, DSP + ARM CORTEX-A8
DSP, 720MHZ, FCBGA-423; Product Range:Sitara Family AM3x Series Microprocessors; MPU Core Size:32bit; Program Memory Size:-; No. of Pins:423Pins; MPU Case Style:FCBGA; Supply Voltage Min:1.71V; Supply Voltage Max:1.89V; Operating Temperature Min:0°C; Operating Temperature Max:90°C; CPU Speed:720MHz; Embedded Interface Type:I2C, SPI, UART, USB; MPU Family:Sitara; MPU Series:AM3x; Automotive Qualification Standard:-; RoHS Phthalates Compliant:Yes; MSL:MSL 3 - 168 hours; SVHC:No SVHC (27-Jun-2018); Core Supply Voltage Max:1.35V; Core Supply Voltage Min:0.985V; DSP Case Style:FCBGA; Frequency:720MHz; No. of I/O's:170I/O's
Manufacturer Aliases
Texas Instruments has several brands around the world that distributors may use as alternate names. Texas Instruments may also be known as the following names:
- TI
- TEXAS
- TEXAS INST
- TEXAS INSTR
- TEXAS INSTRUMENT
- TEXAS INSTRUMENTS INC
- TEXAS INS
- TEXAS INSTRU
- TEXAS INSTRUMEN
- TI/NS
- TEX
- Texas Instruments (TI)
- TEXASIN
- TEXAS INSTRUMENTS INCORPORATED
- TEXINS
- TEXAS INTRUMENTS
- TEAXS
- TEXASI
- TEXAS INSTRUM
- TI Texas Instruments
- TEXAS USD
- TEXAS INSRUMENTS
- TEXAS INSRUMENT
- TEXAS INSTUMENTS
- TI-ROHS
- Texas Instr.
- Texas Instruments Inc.
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageFCBGA
MountSurface Mount
Number of Pins423
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency720 MHz
InterfaceI2C, SPI, UART, USB
Max Frequency720 MHz
Max Operating Temperature90 °C
Max Supply Voltage1.35 V
Memory Size112 kB
Memory TypeL2 Cache, ROM, SRAM
Min Operating Temperature0 °C
Min Supply Voltage985 mV
Number of I/Os170
Number of UART Channels3
PackagingCut Tape
RAM Size64 kB
Voltage1.35 V
Dimensions
Height1.4 mm
Length16 mm
Thickness960 µm
Width16 mm
Compliance
Environmental Classification
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCNo
RoHSCompliant
Compliance Statements