NXP Semiconductors MPC875VR133
Obsolete
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors MPC875VR133.
Alternate Parts
This Part
Alternate Parts
Price @ 1000
$ 25.515
Stock
166,630
139,520
Authorized Distributors
1
3
Case/Package
BGA
BGA
Number of Pins
256
256
Core Architecture
PowerPC
PowerPC
Data Bus Width
32 b
32 b
Max Frequency
133 MHz
133 MHz
Interface
I2C, SPI, UART
-
Min Supply Voltage
1.7 V
1.7 V
Max Supply Voltage
1.9 V
1.9 V
Supply Chain
Country of OriginMalaysia
Export Control Classification Number (ECCN) Code5A002
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2003-12-17
Lifecycle StatusObsolete (Last Updated: 4 months ago)
Related Parts
NXP SemiconductorsMPC870CVR133
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.18um 133MHz 3.3V 256-Pin BGA Tray
NXP SemiconductorsMPC875CVR133
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.18um 133MHz 3.3V 256-Pin BGA Tray
NXP SemiconductorsMPC870ZT133
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.18um 133MHz 3.3V 256-Pin BGA Tray
Descriptions
Descriptions of NXP Semiconductors MPC875VR133 provided by its distributors.
MPU MPC8xx RISC 32-Bit 0.18um 133MHz 3.3V 256-Pin BGA Tray
RISC Microprocessor, 32-Bit, 133MHz, CMOS, PBGA256
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)
MPU, 32BIT, 133MHZ, BGA-256; Series:MPC8xx; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; Digital IC Case Style:BGA; No. of Pins:256; CPU Speed:133MHz; Embedded Interface Type:Ethernet, I2C, SPI, UART; Operating Temperature Min:0°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Technical Specifications
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins256
Number of Terminals256
Weight1.662955 g
Technical
Core ArchitecturePowerPC
Data Bus Width32 b
Frequency133 MHz
InterfaceI2C, SPI, UART
Max Frequency133 MHz
Max I/O Voltage3.3 V
Max Operating Temperature95 °C
Max Supply Voltage1.9 V
Memory Size8 kB
Min Operating Temperature0 °C
Min Supply Voltage1.7 V
Number of Bits32
Number of Cores1
Operating Supply Voltage1.8 V
RAM Size8 kB
Dimensions
Height - Seated (Max)2.54 mm
Length23 mm
Terminal Pitch1.27 mm
Width23 mm
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors MPC875VR133.
Compliance
Environmental Classification
China RoHSCompliant
Halogen FreeNot Halogen Free
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance Statements