AMD XC7Z035-2FFG900I
$ 2,458.75
Production
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Inventory History
3 month trend: -100%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
CAD Models
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Supply Chain
Country of OriginTaiwan
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2014-10-08
Lifecycle StatusProduction (Last Updated: 3 months ago)
Related Parts
FPGA Kintex-7 Family 275000 Cells 28nm Technology Automotive Medical 676-Pin Lidless FCBGA
Descriptions
Descriptions of AMD XC7Z035-2FFG900I provided by its distributors.
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA
IC SOC CORTEX-A9 800MHZ 900FCBGA "Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 800MHz 900-FCBGA (31x31)"
800MHz 256KB SRAM DMA 130 1.03V CANbus，EBI，EMI，Ethernet，I2C，MMC，SD，SDIO，SPI，UART，USART，USB OTG Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ FBGA-900 SMD mount 31mm*31mm*3.15mm
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-2FFG900I
Manufacturer Aliases
AMD has several brands around the world that distributors may use as alternate names. AMD may also be known as the following names:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Inventory History
3 month trend: -100%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Terminals900
Technical
Core ArchitectureARM
Frequency800 MHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Operating Temperature100 °C
Max Supply Voltage1.05 V
Min Operating Temperature-40 °C
Min Supply Voltage950 mV
Nominal Supply Voltage (DC)1 V
Number of I/Os130
Number of Registers343800
PeripheralsDMA
Propagation Delay100 ps
RAM Size250 kB
Speed Grade2
Dimensions
Height - Seated (Max)3.35 mm
Length31 mm
Terminal Pitch1 mm
Width31 mm