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ATS-61310D-C1-R0Stocked at Master Electronics
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Results: 201
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 30.25x30.25x9.5mm, 30.25mm dia.
Advanced Thermal Solutions
Manufacturer Page
SMART HIGHSIDE POWER SWITCH Buffer/Inverter Based Peripheral Driver, 1 Driver, 10A, MOS, PSSO4
Infineon
CAD Models
Manufacturer Page
TS613IDT
$ 0.546
TS613 Series 6 V 130 MHz Dual Wide Band Operational Amplifier - SOIC-8
STMicroelectronics
Manufacturer Page
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 30.25x30.25x14.5mm, 30.25mm dia.
Advanced Thermal Solutions
Manufacturer Page
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 34.25x34.25x9.5mm, 34.25mm dia.
Advanced Thermal Solutions
Manufacturer Page
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 34.25x34.25x19.5mm, 34.25mm dia.
Advanced Thermal Solutions
Manufacturer Page
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 34.25x34.25x14.5mm, 34.25mm dia.
Advanced Thermal Solutions
Manufacturer Page
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 30.25x30.25x19.5mm, 30.25mm dia.
Advanced Thermal Solutions
Manufacturer Page
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 31.75x31.75x9.5mm, 31.75mm dia.
Advanced Thermal Solutions
Manufacturer Page
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 29.25x29.25x9.5mm, 29.25mm dia.
Advanced Thermal Solutions
Manufacturer Page