Winbond W971GG8JB-25
Production
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Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.02
Introduction Date2010-10-19
Lifecycle StatusProduction (Last Updated: 1 year ago)
LTB Date2015-04-30
LTD Date2015-07-31
Descriptions
Descriptions of Winbond W971GG8JB-25 provided by its distributors.
16M X 8 BANKS X 8 BITS DDR2 SDRAM DDR2 DRAM, 16MX8, 0.4ns, CMOS, PBGA60
DRAM Chip DDR2 SDRAM 1G-Bit 128Mx8 1.8V 60-Pin WBGA
IC DDR2 SDRAM 1GBIT 2.5NS 60WBGA
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Case/PackageTFBGA
Number of Pins60
Number of Terminals60
Technical
Access Time400 ps
Address Bus Width17 b
Data Bus Width8 b
Density1 Gb
InterfaceParallel
Max Frequency400 MHz
Max Operating Temperature85 °C
Max Supply Current180 mA
Max Supply Voltage1.9 V
Memory TypeDDR2 SDRAM, RAM
Min Operating Temperature0 °C
Min Supply Voltage1.7 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Dimensions
Height - Seated (Max)1.2 mm
Length12.5 mm
Terminal Pitch800 µm
Width8 mm