Winbond W949D2DBJX5I
$ 8.79
Production
Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2014-01-06
Lifecycle StatusProduction (Last Updated: 8 months ago)
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IC DRAM 64M PARALLEL 54TFBGA / 1 Meg Bits x 16 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
Descriptions
Descriptions of Winbond W949D2DBJX5I provided by its distributors.
R-PBGA-B90 Surface Mount Tray 16MX32 ic memory 200MHz 5ns 8mm 536870912bit
DRAM Chip Mobile LPDDR SDRAM 512Mbit 16Mx32 1.8V 90-Pin VFBGA
DRAM 512Mb LPDDR, x32, 200MHz, Industrial Temp, 46nm
IC DRAM 512MBIT PARALLEL 90VFBGA
VFBGA90 512MB LP DDR X32 200MH
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Case/PackageTFBGA
Number of Terminals90
Technical
Access Time5 ns
Frequency200 MHz
InterfaceParallel
Max Operating Temperature85 °C
Max Supply Voltage1.95 V
Memory TypeLPDDR, RAM, SDRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.7 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Schedule B8542320015
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.025 mm
Length13 mm
Terminal Pitch800 µm
Width8 mm