Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.32
Introduction Date2013-06-07
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2018-02-01
LTD Date2018-05-01
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Descriptions
Descriptions of Winbond W631GU6KB12I provided by its distributors.
DDR3L DRAM, 64MX16, 0.225ns, CMOS, PBGA96
IC SOC CORTEX-M3 166MHZ 400VFBGA
IC DRAM 1GBIT PARALLEL 96WBGA
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Case/PackageTFBGA
Number of Terminals96
Technical
Access Time225 ps
Frequency800 MHz
InterfaceParallel
Max Frequency800 MHz
Max Operating Temperature85 °C
Max Supply Current400 mA
Max Supply Voltage1.45 V
Memory TypeRAM, SDRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.283 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.35 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.2 mm
Length13 mm
Terminal Pitch800 µm
Width9 mm