AMD XC3S700AN-4FGG484C
Obsolete
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Datasheets & Documents
Download datasheets and manufacturer documentation for AMD XC3S700AN-4FGG484C.
Supply Chain
Country of OriginTaiwan
Export Control Classification Number (ECCN) Code3A991.D
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2007-02-26
Lifecycle StatusObsolete (Last Updated: 1 month ago)
LTB Date2024-06-29
LTD Date2024-12-28
Related Parts
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Descriptions
Descriptions of AMD XC3S700AN-4FGG484C provided by its distributors.
FPGA Spartan-3AN Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 484-Pin FBGA
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA484
XILINX XC3S700AN-4FGG484C FPGA, SPARTAN-3AN, 13248CELLS, 484FBGA
PLD Logic; Programmable Logic Type:FPGA; Logic Type:FPGA; Logic Family:CMOS; Logic Base Number:3S700; No. of I/O Pins:372; Frequency Max:667MHz; I/O Output Drive:24 mA; Supply Voltage Min:1.14V; Supply Voltage Max:1.26V ;RoHS Compliant: Yes
FPGA,SPARTAN-3AN,13248CELLS,484FBGA; Programmable Logic Type:FPGA; Logic IC Function:FPGA; Logic IC Family:CMOS; Logic IC Base Number:3S700; I/O lines, No. of:372; Macrocells, No. of:13248; Frequency:667MHz; I/O Interface Standard:LVCMOS, LVTTL, HSTL, SSTL, True LVDS, RSDS, mini-L; Voltage, Supply Min:1.14V; Voltage, Supply Max:1.26V; Case Style:FBGA; Temperature, Operating Range:0°C to +85°C; Base Number:3; Pins, No. of:484; Temp, Op. Max:85°C; Temp, Op. Min:0°C; Termination Type:SMD
Manufacturer Aliases
AMD has several brands around the world that distributors may use as alternate names. AMD may also be known as the following names:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Technical Specifications
Physical
Case/PackageBGA
MountSurface Mount
Number of Pins484
Number of Terminals484
Technical
Frequency667 MHz
Max Frequency667 MHz
Max Operating Temperature85 °C
Max Supply Voltage1.26 V
Min Operating Temperature0 °C
Min Supply Voltage1.14 V
Number of Gates700000
Number of I/Os372
Number of Inputs372
Number of Logic Blocks (LABs)1472
Number of Logic Elements/Cells13248
Number of Macrocells13248
Number of Outputs288
Operating Supply Voltage1.2 V
RAM Size45 kB
Speed Grade4
TerminationSMD/SMT
Dimensions
Height1.7 mm
Height - Seated (Max)2.6 mm
Length23 mm
Terminal Pitch1 mm
Width23 mm
Datasheets & Documents
Download datasheets and manufacturer documentation for AMD XC3S700AN-4FGG484C.