NXP Semiconductors MCF5272VM66
Obsolete
Prix et stock
Distributeurs agréés
Distributeurs de solutions de stockage non agréés
Revendeurs non agréés
| Distributor | SKU | Min | Pkg | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Verical | MCF5272VM66 | 22 000 | 2K | |||||||||
| Flip Electronics | MCF5272VM66 | 22 000 | 5d | |||||||||
| Farnell | MCF5272VM66 | 0 | 1 | Tape & Reel | 14h | |||||||
| HQonline | IC0146993 | 10 | 1 | >1w | ||||||||
| Microchip USA | MCF5272VM66 | 162 | 50 | Tray | 6d |
Historique des stocks
Tendance sur 3 mois : +0.00%
Modèles CAO
Télécharger le symbole, l’empreinte et le 3D STEP
Pièces de rechange
1 composant disponible
Pièces de rechange
Ce composant
Pièces de rechange
Price @ 1000
$ 50.82
$ 50.82
Stock
314,017
226,612
226,612
Authorized Distributors
3
3
3
Case/Package
BGA
BGA
BGA
Number of Pins
196
-
-
Core Architecture
Coldfire
Coldfire
Coldfire
Data Bus Width
32 b
32 b
32 b
Max Frequency
66 MHz
66 MHz
66 MHz
Number of I/Os
32
32
32
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
Memory Type
ROM, SRAM
ROM
ROM
Memory Size
16 kB
16 kB
16 kB
Min Supply Voltage
3 V
3 V
3 V
Max Supply Voltage
3.6 V
3.6 V
3.6 V
Peripherals
DMA, WDT
DMA, WDT
DMA, WDT
Chaîne d'approvisionnement
Country of OriginMainland China, Malaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2002-03-12
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2021-12-01
LTD Date2023-12-01
Pièces détachées
NXP SemiconductorsMCF5272VF66
Coldfire V2 MCF527x Microcontroller IC 32-Bit 66MHz 16KB (4K x 32) ROM 196-MAPBGA (15x15)
NXP SemiconductorsMCF52258CVN66
MCU 32-bit MCF5225x ColdFire RISC 512KB Flash 3.3V Automotive 144-Pin MAP-BGA Tray
NXP SemiconductorsMCF52258VN80J
ROHS3Compliant Surface Mount FLASH Internal Microcontroller 0C~70C TA 80MHz 64K x 8 3V~3.6V
STMicroelectronicsSTR710FZ2H6
ARM7TDMI™ 16/32-BIT MCU WITH FLASH, USB, CAN, 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES
MicrochipAT91SAM7SE32-CU
IC, 32-BIT MCU, ARM7, 48MHZ, 144-LFBGA; Controller Family/Series:(ARM7); Core Si
MicrochipAT91SAM7SE32-CU-999
Microcontroller 32-Bit ARM7TDMI RISC 32KB Flash 1.8V/3.3V 144-Pin LFBGA T/R
Descriptions
Descriptions de NXP Semiconductors MCF5272VM66 fournies par ses distributeurs.
MPU ColdFire MCF5xxx Processor RISC 32-Bit 66MHz 3.3V 196-Pin MAP-BGA Tray
COLDFIRE INTEGRATED RISC MICROPROCESSOR RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA196
MCF527x Series 16 KB Flash 1 KB RAM ColdfireV2 32-Bit Microcontroller-MAPBGA-196
1 66MHz ROM 1 3V 3.6V 66MHz 1KB 3.3V EBI,EMI,Ethernet,I2C,SPI,UART,USART,USB 10Mbps,100Mbps 32bit Coldfire V2 PGBA-196 15mm*15mm*1.6mm
Mpu, 32Bit, 66Mhz, Bga-196; Product Range:coldfire V2 Family Mcf527X Series Microprocessors; Mpu Core Size:32Bit; Program Memory Size:1Kb; No. Of Pins:196Pins; Mpu Case Style:bga; Supply Voltage Min:3V; Supply Voltage Max:3.6V Rohs Compliant: Yes
CPU COLDFIRE 4K SRAM, SMD, 5272VM66; Series:ColdFire V2 MPU; Core Size:32bit; Program Memory Size:1 KB; CPU Speed:66MHz; Digital IC Case Style:MAPBGA; No. of Pins:196; Supply Voltage Range:3V to 3.6V; Operating Temperature Range:0°C to +70°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2011); Base Number:5272; Cache on Chip L1/L2 Memory:1KB; Clock Frequency:66MHz; EEPROM Memory Size:0Byte; Frequency Typ:66MHz; IC Generic Number:5272VM66; IC Temperature Range:Commercial; Interface Type:UART, USB, TDM, QSPI, Ethernet; Logic Function Number:66; Memory Size:0; Memory Type:SRAM; Microprocessor/Controller Features:IEEE 802.3 compliant Ethernet Controller, USB 1.1 device controller and transceiver, 3 PWM outputs, 2 UARTs, 1-channel DMA; No. of Bits:32; No. of I/O's:32; No. of Timers:4; Operating Temperature Max:70°C; Operating Temperature Min:0°C; Package / Case:MAP-BGA; Qualified Segment:COMMERCIAL, INDUSTRIAL; RAM Memory Size:4KB; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:SMD
Alias du fabricant
NXP Semiconductors possède plusieurs marques à travers le monde que les distributeurs peuvent utiliser comme noms alternatifs. NXP Semiconductors peut également être connu sous les noms suivants :
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Historique des stocks
Tendance sur 3 mois : +0.00%
Modèles CAO
Télécharger le symbole, l’empreinte et le 3D STEP
Pièces de rechange
1 composant disponible
Spécifications techniques
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins196
Number of Terminals196
Weight482.537233 mg
Technical
Core ArchitectureColdfire
Data Bus Width32 b
Frequency66 MHz
InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
Max Frequency66 MHz
Max I/O Voltage3.3 V
Max Operating Temperature70 °C
Max Supply Voltage3.6 V
Memory Size16 kB
Memory TypeROM, SRAM
Min Operating Temperature0 °C
Min Supply Voltage3 V
Number of Bits32
Number of I/Os32
Number of Timers/Counters4
Operating Supply Voltage3.3 V
Oscillator TypeExternal
PeripheralsDMA, WDT
RAM Size4 kB
Schedule B8542310000
Temperature GradeCommercial
TerminationSMD/SMT
Dimensions
Height - Seated (Max)1.75 mm
Length15 mm
Terminal Pitch1 mm
Width15 mm
Conformité
Classification environnementale
China RoHSCompliant
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Déclarations de conformité