NXP Semiconductors MC9S12XDP512VAL
$ 36.76
NRND
Prix et stock
Distributeurs agréés
Distributeurs de solutions de stockage non agréés
Revendeurs non agréés
| Distributor | SKU | Min | Pkg | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Verical | MC9S12XDP512VAL | 120 | 1 | |||||||||
| Newark | MC9S12XDP512VAL | 0 | 300 | |||||||||
| Avnet | MC9S12XDP512VAL | 0 | 300 | 22h | ||||||||
| Arrow Electronics | MC9S12XDP512VAL | 0 | 300 | |||||||||
| Farnell | MC9S12XDP512VAL. | 0 | 300 | 20h |
Historique des stocks
Tendance sur 3 mois : +138%
Modèles CAO
Télécharger le symbole, l’empreinte et le 3D STEP
Pièces de rechange
1 composant disponible
Fiches techniques et documents
Téléchargez les fiches techniques et la documentation du fabricant pour NXP Semiconductors MC9S12XDP512VAL.
Pièces de rechange
Ce composant
Pièces de rechange
Price @ 1000
$ 36.76
$ 35.12
$ 35.12
Stock
185,968
193,655
193,655
Authorized Distributors
6
6
6
Case/Package
LQFP
LQFP
LQFP
Number of Pins
112
112
112
Core Architecture
HCS12
HCS12
HCS12
Data Bus Width
16 b
16 b
16 b
Max Frequency
40 MHz
40 MHz
40 MHz
Number of I/Os
91
91
91
Interface
CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Memory Type
FLASH
FLASH
FLASH
Memory Size
512 kB
512 kB
512 kB
Min Supply Voltage
2.35 V
2.35 V
2.35 V
Max Supply Voltage
2.75 V
2.75 V
2.75 V
Peripherals
I2C, LVD, POR, PWM, WDT
I2C, LVD, POR, PWM, WDT
I2C, LVD, POR, PWM, WDT
Chaîne d'approvisionnement
Country of OriginMalaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2004-06-09
Lifecycle StatusNRND (Last Updated: 3 weeks ago)
Pièces détachées
NXP SemiconductorsMC9S12XDT512CAL
MCU 16-bit HCS12X HCS12X CISC 512KB Flash 2.5V/5V 112-Pin LQFP Brick
NXP SemiconductorsMC9S12XDT512MAL
MCU 16-bit HCS12X HCS12X CISC 512KB Flash 2.5V/5V Automotive 112-Pin LQFP Brick
NXP SemiconductorsMC9S12XA256CAL
MCU 16-bit HCS12X HCS12X CISC 256KB Flash 2.5V/5V Automotive 112-Pin LQFP Brick
Descriptions
Descriptions de NXP Semiconductors MC9S12XDP512VAL fournies par ses distributeurs.
MCU 16-bit HCS12X HCS12X CISC 512KB Flash 2.5V/5V Automotive 112-Pin LQFP Brick
HCS12X HCS12X Microcontroller IC 16-Bit 80MHz 512KB (512K x 8) FLASH 112-LQFP (20x20)
S12XD 16-bit MCU, HCS12X core, 512KB Flash, 80MHz, QFP 112
ROHS3Compliant GULL WING QUAD CMOS Microcontroller 2.55V -40C~105C TA 80MHz 1.6mm
Microcontroller, 16-Bit, FLASH, CPU12 CPU, 40MHz, CMOS, PQFP112
MCU, 16BIT, HCS12, 40MHZ, LQFP-112; Product Range: HCS12X Family S12XD Series Microcontrollers; Architecture: HCS12; No. of Bits: 16bit; CPU Speed: 40MHz; Program Memory Size: 512KB; RAM Memory Size: 32KB; No. of Pins: 112Pins;
; Core Size:16-bit; EEPROM Memory Size:4096Byte; RAM Memory Size:32768Byte; No. of Timers:5; No. of Pins:112; Clock Frequency:40MHz; Leaded Process Compatible:Yes; No. of I/O Pins:91; Peak Reflow Compatible (260 C):Yes ;RoHS Compliant: Yes
MCU, 16BIT, HCS12X, 80MHZ, LQFP-112; Controller Family/Series:S12XD; Core Size:16bit; No. of I/O's:91; Supply Voltage Min:3.15V; Supply Voltage Max:5.5V; Digital IC Case Style:LQFP; No. of Pins:112; Program Memory Size:512KB; EEPROM Memory Size:4KB; RAM Memory Size:32KB; CPU Speed:80MHz; Peripherals:ADC, PWM, Timer; Embedded Interface Type:CAN, I2C, SCI, SPI; Operating Temperature Min:-40°C; Operating Temperature Max:105°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)
Device Core = HCS12X / Data Bus Width Bit = 16 / Instruction Set Architecture = CISC / Family Name = S12XD / Clock Frequency Max. MHz = 80 / Program Memory Type = Flash / Program Memory Size kB = 512 / RAM Memory Size kB = 32 / Interfaces = I²C / Interfaces = SCI / Interfaces = SPI / Interfaces = CAN / ADC Channels = 16 / ADC Resolution Bit = 10 / Number of Programmable I/Os = 91 / Number of Timers/Counters = 5 / Comparators = 4 / Supply Voltage Min. V = 3.15 / Supply Voltage Max. V = 5.5 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LQFP / Pins = 112 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 20 / Width mm = 20 / Height mm = 1.4 / Reflow Temperature Max. °C = 260
Alias du fabricant
NXP Semiconductors possède plusieurs marques à travers le monde que les distributeurs peuvent utiliser comme noms alternatifs. NXP Semiconductors peut également être connu sous les noms suivants :
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Historique des stocks
Tendance sur 3 mois : +138%
Modèles CAO
Télécharger le symbole, l’empreinte et le 3D STEP
Pièces de rechange
1 composant disponible
Spécifications techniques
Physical
Case/PackageLQFP
Contact PlatingTin
MountSurface Mount
Number of Pins112
Number of Terminals112
Weight1.278308 g
Technical
Access Time40 µs
Core ArchitectureHCS12
Data Bus Width16 b
Frequency80 MHz
InterfaceCAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Max Frequency40 MHz
Max Operating Temperature105 °C
Max Supply Voltage2.75 V
Memory Size512 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.35 V
Number of I/Os91
Number of Programmable I/O91
Number of PWM Channels8
Number of Timers/Counters12
Operating Supply Voltage2.5 V
Oscillator TypeExternal
PeripheralsI2C, LVD, POR, PWM, WDT
RAM Size32 kB
Schedule B8542310000
Temperature GradeIndustrial
Watchdog TimerYes
Dimensions
Height - Seated (Max)1.6 mm
Length20 mm
Terminal Pitch650 µm
Width20 mm
Fiches techniques et documents
Téléchargez les fiches techniques et la documentation du fabricant pour NXP Semiconductors MC9S12XDP512VAL.
Conformité
Classification environnementale
China RoHSCompliant
Halogen FreeHalogen Free
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Déclarations de conformité