NXP Semiconductors MCF5272VM66
$ 33.674
Obsolete
Preis und Lagerbestand
Autorisierte Distributoren
Nicht-autorisierte lagerhaltende Distributoren
Nicht autorisierte Händler
| Distributor | SKU | Min | Pkg | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Verical | MCF5272VM66 | 152.000 | 2K | |||||||||
| UnikeyIC | MCF5272VM66 | 22.000 | 20 | Cut Tape | 13h | |||||||
| Flip Electronics | MCF5272VM66 | 22.000 | 4d | |||||||||
| Farnell | MCF5272VM66 | 0 | 1 | Tape & Reel | 13h | |||||||
| Microchip USA | MCF5272VM66 | 160 | 50 | Tray | 4d |
Bestandsverlauf
3-Monats-Trend: +0.00%
CAD-Modelle
Symbol, Footprint und 3D STEP herunterladen
Alternative Teile
1 Teil verfügbar
Alternative Teile
Dieser Teil
Alternative Teile
Price @ 1000
$ 33.674
$ 35.562
$ 35.562
Stock
446,306
233,592
233,592
Authorized Distributors
4
5
5
Case/Package
BGA
BGA
BGA
Number of Pins
196
196
196
Core Architecture
Coldfire
Coldfire
Coldfire
Data Bus Width
32 b
32 b
32 b
Max Frequency
66 MHz
66 MHz
66 MHz
Number of I/Os
32
32
32
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
Memory Type
ROM, SRAM
ROM
ROM
Memory Size
16 kB
16 kB
16 kB
Min Supply Voltage
3 V
3 V
3 V
Max Supply Voltage
3.6 V
3.6 V
3.6 V
Peripherals
DMA, WDT
DMA, WDT
DMA, WDT
Lieferkette
Country of OriginMainland China, Malaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2002-03-12
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2021-12-01
LTD Date2023-12-01
Verwandte Teile
NXP SemiconductorsMCF5272VF66
Coldfire V2 MCF527x Microcontroller IC 32-Bit 66MHz 16KB (4K x 32) ROM 196-MAPBGA (15x15)
NXP SemiconductorsMCF52258CVN66
MCU 32-bit MCF5225x ColdFire RISC 512KB Flash 3.3V Automotive 144-Pin MAP-BGA Tray
NXP SemiconductorsMCF52258VN80J
ROHS3Compliant Surface Mount FLASH Internal Microcontroller 0C~70C TA 80MHz 64K x 8 3V~3.6V
STMicroelectronicsSTR710FZ2H6
ARM7TDMI™ 16/32-BIT MCU WITH FLASH, USB, CAN, 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES
MicrochipAT91SAM7SE32-CU
IC, 32-BIT MCU, ARM7, 48MHZ, 144-LFBGA; Controller Family/Series:(ARM7); Core Si
MicrochipAT91SAM7SE32-CU-999
Microcontroller 32-Bit ARM7TDMI RISC 32KB Flash 1.8V/3.3V 144-Pin LFBGA T/R
Beschreibungen
Beschreibungen von NXP Semiconductors MCF5272VM66, die von den Distributoren bereitgestellt werden.
MPU ColdFire MCF5xxx Processor RISC 32-Bit 66MHz 3.3V 196-Pin MAP-BGA Tray
COLDFIRE INTEGRATED RISC MICROPROCESSOR RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA196
MCF527x Series 16 KB Flash 1 KB RAM ColdfireV2 32-Bit Microcontroller-MAPBGA-196
1 66MHz ROM 1 3V 3.6V 66MHz 1KB 3.3V EBI,EMI,Ethernet,I2C,SPI,UART,USART,USB 10Mbps,100Mbps 32bit Coldfire V2 PGBA-196 15mm*15mm*1.6mm
Mpu, 32Bit, 66Mhz, Bga-196; Product Range:coldfire V2 Family Mcf527X Series Microprocessors; Mpu Core Size:32Bit; Program Memory Size:1Kb; No. Of Pins:196Pins; Mpu Case Style:bga; Supply Voltage Min:3V; Supply Voltage Max:3.6V Rohs Compliant: Yes
CPU COLDFIRE 4K SRAM, SMD, 5272VM66; Series:ColdFire V2 MPU; Core Size:32bit; Program Memory Size:1 KB; CPU Speed:66MHz; Digital IC Case Style:MAPBGA; No. of Pins:196; Supply Voltage Range:3V to 3.6V; Operating Temperature Range:0°C to +70°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2011); Base Number:5272; Cache on Chip L1/L2 Memory:1KB; Clock Frequency:66MHz; EEPROM Memory Size:0Byte; Frequency Typ:66MHz; IC Generic Number:5272VM66; IC Temperature Range:Commercial; Interface Type:UART, USB, TDM, QSPI, Ethernet; Logic Function Number:66; Memory Size:0; Memory Type:SRAM; Microprocessor/Controller Features:IEEE 802.3 compliant Ethernet Controller, USB 1.1 device controller and transceiver, 3 PWM outputs, 2 UARTs, 1-channel DMA; No. of Bits:32; No. of I/O's:32; No. of Timers:4; Operating Temperature Max:70°C; Operating Temperature Min:0°C; Package / Case:MAP-BGA; Qualified Segment:COMMERCIAL, INDUSTRIAL; RAM Memory Size:4KB; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:SMD
Aliasnamen des Herstellers
NXP Semiconductors verfügt über mehrere Marken auf der ganzen Welt, die von Händlern als alternative Namen verwendet werden können. NXP Semiconductors ist möglicherweise auch unter den folgenden Namen bekannt:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Bestandsverlauf
3-Monats-Trend: +0.00%
CAD-Modelle
Symbol, Footprint und 3D STEP herunterladen
Alternative Teile
1 Teil verfügbar
Technische Spezifikationen
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins196
Number of Terminals196
Weight482.537233 mg
Technical
Core ArchitectureColdfire
Data Bus Width32 b
Frequency66 MHz
InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
Max Frequency66 MHz
Max I/O Voltage3.3 V
Max Operating Temperature70 °C
Max Supply Voltage3.6 V
Memory Size16 kB
Memory TypeROM, SRAM
Min Operating Temperature0 °C
Min Supply Voltage3 V
Number of Bits32
Number of I/Os32
Number of Timers/Counters4
Operating Supply Voltage3.3 V
Oscillator TypeExternal
PeripheralsDMA, WDT
RAM Size4 kB
Schedule B8542310000
Temperature GradeCommercial
TerminationSMD/SMT
Dimensions
Height - Seated (Max)1.75 mm
Length15 mm
Terminal Pitch1 mm
Width15 mm
Compliance
Umweltklassifizierung
China RoHSCompliant
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance-Erklärungen