由其分销商提供的 TE Connectivity 1-1825094-3 的描述。
Socket, DIP; Dual Leaf; 14 Pos.; 0.100In.cen.; Thru Hole; 0.310In.; Ber. Copper; Gold
IC & Component Socket, 14 Contacts, DIP Socket, 2.54 mm, DIPLOMATE DL Series, 7.62 mm
IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Box/Tube
DIP SOCKET, 14POS, THROUGH HOLE; Connect; DIP SOCKET, 14POS, THROUGH HOLE; Connector Type:DIP Socket; Series:DIPLOMATE DL; No. of Contacts:14; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Contact Termination:Through Hole Vertical; Contact Material:Beryllium Copper