由其分销商提供的 TE Connectivity / AMP 2-641610-4 的描述。
Socket, DIP; Dual Leaf; 16 Pos.; 0.100In.cen.; Thru Hole; 0.310In.; Phosphor Bronze; Go
Diplomat DIP Socket with Retention Solder Tail Dual Leaf 16-Position Gold Plating
IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder
CONN IC DIP SOCKET 16POS GOLD
IC Sockets 16P DIP PHBRZ AU
16C DIPLOMATE DL SKT 15AUPHBZ