价格与库存
| Distributor | SKU | Min | Pkg | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Renesas | HIP2100IBZT | 3,940 | 1 | 14h | ||||||||
| DigiKey | HIP2100IBZTCT-ND | 3,940 | 1 | Cut Tape | ||||||||
| Future Electronics | HIP2100IBZT | 0 | 2500 | Tape & Reel | ||||||||
| Newark | HIP2100IBZT | 0 | 2500 | Cut Tape | ||||||||
| Avnet | HIP2100IBZT | 0 | 2500 | 17h |
CAD 模型
引脚表
编号
类别
显示名称和功能
模型信息
| 来源 | Renesas |
|---|---|
| 发布日期 | Aug 11, 2025 |
| 符合 IPC 标准 | IPC-7351B |
| 风格指南修订 | 版本 1.0 - Nov 1, 2024 |
| 数据表来源 | 版本 16.00 - Aug 8, 2019 |
验证
根据该零件的样式指南和数据表，三位独立的电子工程专家创建了：
- 3 个版本的符号和 2D 封装
- 1 个版本的 3D STEP 模型（STEP 格式 AP-214）
- 制造商调色板配置
所有创建的库文件都与图层映射无关，可轻松映射到设计中。
然后通过以下检查对创建的符号和封装进行比较：
符号
自动检查
- 零件编号
- 关键参数
- 包装代码
- 引脚名称/编号
- 引脚类型
手动检查
- 根据样式指南整理引脚
封装
自动检查
- IPC 标准
- 丝印间隙
- Courtyard 超额
- 包装外形
- 极性标记
- 焊盘尺寸和位置验证
3D STEP 模型
手动检查
- 尺寸验证
- 调色板合规性
- 格式合规性
- 将方向映射到 2D 封装
- 2D 封装位置验证
进行最终验证过程：
如果符号和封装匹配：零件已验证为 ECAD 就绪
如果符号和封装不匹配：高级电子工程师将审查所有差异，确保零件符合样式指南和数据表要求
供应链
Country of OriginMainland China
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8540000000
Introduction Date2017-10-27
Lifecycle StatusProduction (Last Updated: 2 months ago)
Manufacturer Lifecycle StatusACTIVE (Last Updated: 2 months ago)
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Cut Tape (CT) EL7212 Low-Side 2002 gate driver 7.5ns 10ns -40C~125C TJ 2A 2A 0.8V 2.4V
描述
由其分销商提供的 Renesas HIP2100IBZT 的描述。
Cut Tape (CT) HIP2100 Half-Bridge Non-Inverting gate driver 10ns 10ns -55C~150C TJ 2A 2A 4V 7V
MOSFET Driver, Half Bridge, 9V to 14V Supply, 2A Out, 20ns Delay, SOIC-8
Driver 2A 2-OUT Hi/Lo Side Half Brdg Non-Inv 8-Pin SOIC N T/R
100V/2A Peak High-Frequency Half Bridge Driver with CMOS Logic Inputs
HIP2100 Series Low Side/High Side N-Ch 114 V 2 A Half Bridge Driver - SOIC-8
GULL WING RoHS Compliant Active Matte Tin (Sn) - annealed IC Gate Driver 4.9mm 114V 1.3W 2A
MOSFET DRIVER, -40 TO 125DEG C; Driver Configuration: Half Bridge; Peak Output Current: 2A; Supply Voltage Min: 9V; Supply Voltage Max: 14V; Driver Case Style: SOIC; No. of Pins: 8Pins; Input Delay: 20ns; Output Delay: 20ns; Ope
制造商别名
Renesas 在全球拥有多个品牌，分销商可将其用作替代名称。Renesas 也可称为以下名称：
- Renesas Electronics
- Renesas Electronics America Inc
- Renesas Electronics America
- RENESA
- REN
- RENES
- RENESAS TECHNOLOGY CORP
- RENESAS TECHNOLOGY
- Renesas Electronics Corporation
- RENESAS ELECTRONICS CORP
- RENSAS
- RENASAS
- Renesas / Intersil
- RNS
- RENESAS-PB
- RENESASTEC
- RENESES
- Renesas Technology America
- Renesas Design Germany GmbH
- Renesas / IDT
- RENESASE
- RENESAS TECHNOLOGY HONG KONG
- Renesas Electronics Operations Services Limited
- RENEASAS
- RENESAS/M
技术规格
Physical
Case/PackageSOIC
MSL1
MountSurface Mount
Number of Pins8
Number of Terminals8
Technical
Fall Time10 ns
Part FamilyHIP2100
Max Operating Temperature125 °C
Max Output Current2 A
Max Power Dissipation440 mW
Max Supply Current3 mA
Max Supply Voltage14 V
Min Operating Temperature-40 °C
Min Supply Voltage9 V
Nominal Supply Current2.5 mA
Number of Circuits1
Number of Drivers2
Number of Outputs2
Operating Supply Voltage12 V
Output Current2 A
Overload ProtectionSupply Undervoltage
PackagingCut Tape
Power Dissipation440 mW
Propagation Delay20 ns
RAM Size48 kB
Rise Time10 ns
Temperature GradeAutomotive
Turn-Off Delay Time2 ns
Turn-On Delay Time2 ns
Dimensions
Height0 m
Height - Seated (Max)1.75 mm
Length4.9 mm
Pitch1.3 mm
Terminal Pitch1.27 mm
Width3.9 mm
文档
下载 Renesas HIP2100IBZT 的数据表和制造商文档。
官方数据表6 年前