备用零件
Price @ 1000
$ 71.617
Stock
224,958
186,953
Authorized Distributors
2
4
Case/Package
QFP
-
Number of Pins
208
208
Core Architecture
Coldfire
Coldfire
Data Bus Width
32 b
32 b
Max Frequency
33.33 MHz
33.33 MHz
Number of I/Os
16
16
Interface
EBI/EMI, I2C, SPI, UART, USART
EBI/EMI, I2C, UART, USART
Memory Type
ROMless
ROMless
Memory Size
8 kB
-
Min Supply Voltage
3 V
3 V
Max Supply Voltage
3.6 V
3.6 V
Peripherals
DMA, POR, WDT
DMA, POR, WDT
供应链
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2002-01-01
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2021-12-01
LTD Date2023-12-01
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描述
由其分销商提供的 NXP Semiconductors MCF5307AI66B 的描述。
MPU ColdFire MCF5xxx Processor RISC 32-Bit 0.35um 66MHz 5V 208-Pin FQFP Tray
RISC Microprocessor, 32-Bit, 66MHz, CMOS, PQFP208
32-BIT 66 MHz RISC PROCESSOR PQFP208
IC MPU 32BIT COLDF 66MHZ 208FQFP
NXP MCF5307AI66B CPU COLDFIRE 4K SRAM, SMD, 5307AI66
Automotive Qualification Standard:-; Msl:msl 3 - 168 Hours; Product Range:coldfire V3 Mcf530X Series; Cpu Speed:66Mhz; Clock Frequency:66Mhz; Controller Family/series:coldfire; Embedded Interface Type:i2C, Uart; Filter Terminals:smd Rohs Compliant: Yes
CPU COLDFIRE 4K SRAM, SMD, 5307AI66; SVHC:Cobalt dichloride; Series:MCF53; No. of Bits:32; Typ Frequency:66MHz; Cache on Chip L1/L2 Memory:16KB; Interface Type:I2C, UART; No of I/O Lines:16; Voltage, Supply Max:3.3V; Termination Type:SMD; Case Style:FQFP; No. of Pins:208; Operating Temperature Range:0°C to +70°C; Temp, Op. Max:70°C; Temp, Op. Min:0°C; Base Number:5307; Clock Frequency:66MHz; IC Generic Number:5307AI66; Logic Function Number:66B; Memory Size:0; Memory Type:SRAM, 4-Channel DMA Controller, 2 UARTs; Microprocessor/Controller Features:I2C Compatible Bus; Qualified Segment:COMMERCIAL, INDUSTRIAL; Temperature Range, IC:Commercial; Timers, No. of:2; EEPROM Size:0Byte; Memory Size, RAM:4KB
制造商别名
NXP Semiconductors 在全球拥有多个品牌，分销商可将其用作替代名称。NXP Semiconductors 也可称为以下名称：
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
技术规格
Physical
Case/PackageQFP
Contact PlatingTin
MountSurface Mount
Number of Pins208
Number of Terminals208
Weight5.69644 g
Technical
Core ArchitectureColdfire
Data Bus Width32 b
Frequency66 MHz
InterfaceEBI/EMI, I2C, SPI, UART, USART
Max Frequency33.33 MHz
Max I/O Voltage5 V
Max Operating Temperature70 °C
Max Supply Voltage3.6 V
Memory Size8 kB
Memory TypeROMless
Min Operating Temperature0 °C
Min Supply Voltage3 V
Number of Bits32
Number of I/Os16
Number of Programmable I/O16
Number of Timers/Counters2
Operating Supply Voltage3.3 V
Oscillator TypeExternal
PeripheralsDMA, POR, WDT
RAM Size4 kB
Schedule B8542310000
Temperature GradeCommercial
Dimensions
Height - Seated (Max)4.1 mm
Length28 mm
Terminal Pitch500 µm
Width28 mm