NXP Semiconductors SGTL5000XNAA3R2
$ 2.63
Obsolete
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Inventory History
3 month trend: +0.00%
CAD Models
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Alternate Parts
0 parts available
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors SGTL5000XNAA3R2.
CAD Models
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Supply Chain
Harmonized Tariff Schedule (HTS) Code8542.39.00.01
Introduction Date2008-11-25
Lifecycle StatusObsolete (Last Updated: 5 months ago)
LTB Date2022-02-10
LTD Date2022-03-31
Descriptions
Descriptions of NXP Semiconductors SGTL5000XNAA3R2 provided by its distributors.
Audio Codec , Ultra Low-Power, 4 mw for DAC-to-HP, 98 dB SNR and -80 dB THD+N, QFN 32, Reel
SGTL5000 Series 3.6V 4.67mA Low Power Stereo Codec with Headphone Amp - QFN-32EP
Tape & Reel (TR) 8542.39.00.01 Active Matte Tin (Sn) codec 1.62V~3.6V 5mm -40C~85C
General Purpose Audio Codec 1ADC / 1DAC Ch Medical 32-Pin QFN EP
AUDIO CODEC, STEREO, 48KSPS, QFN-32; Audio CODEC Type: Stereo; No. of ADCs: 1; No. of DACs: 1; Operating Temperature Min: -40°C; Operating Temperature Max: 85°C; Sampling Rate: 48kSPS; Audio IC Case Style: QFN; No. of Pins: 32Pins; No. of Input Channels: 2Channels; No. of Output Channels: 2Channels; ADC / DAC Resolution: 24bit; ADCs / DACs Signal to Noise Ratio: 100dB; IC Interface Type: I2C, I2S, SPI; Supply Voltage Range: 1.62V to 3.6V; Product Range: -; Automotive Qualification Standard: -; MSL: MSL 3 - 168 hours; SVHC: No SVHC (15-Jan-2019)
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageQFN EP
Contact PlatingTin
Number of Pins32
Number of Terminals32
Weight62.3973 mg
Technical
Ambient Temperature Range High85 °C
Data PolaritySINGLE-ENDED
InterfaceI2C, I2S, SPI
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Min Operating Temperature-40 °C
Min Supply Voltage1.1 V
Nominal Supply Voltage (DC)1.2 V
Number of A/D Converters1
Number of ADC Channels1
Number of Analog Inputs1
Number of Analog Outputs1
Number of Channels2
Number of Circuits1
Number of D/A Converters1
Number of DAC Channels1
PackagingTape and Reel
Resolution3 B
Sampling Rate96 ksps
Schedule B8542390000
Signal to Noise Ratio (SNR)85 dB
Temperature GradeIndustrial
TypeGeneral Purpose
Dimensions
Height900 µm
Height - Seated (Max)900 µm
Length5 mm
Terminal Pitch500 µm
Width5 mm
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors SGTL5000XNAA3R2.
Compliance
Environmental Classification
China RoHSCompliant
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance Statements