Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors BGS8M2.
Supply Chain
Country of OriginMainland China
Introduction Date2016-03-29
Lifecycle StatusObsolete (Last Updated: 3 weeks ago)
LTB Date2026-03-31
LTD Date2026-12-30
Descriptions
Descriptions of NXP Semiconductors BGS8M2 provided by its distributors.
RF Front End Circuit, PBCC6
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Technical Specifications
Physical
Number of Terminals6
Technical
Max Operating Temperature85 °C
Min Operating Temperature-40 °C
Nominal Supply Voltage (DC)1.8 V
Number of Circuits1
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)400 µm
Length1.1 mm
Terminal Pitch400 µm
Width700 µm
Datasheets & Documents
Download datasheets and manufacturer documentation for NXP Semiconductors BGS8M2.