Bergquist K10-54

SIL-PAD, K-10, .006", TO-220; Insulator Body Material: PI (Polyimide) Film; Thermal Conductivity: 1.3W/m.K; Breakdown...

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Datasheets & Documents

Download datasheets and manufacturer documentation for Bergquist K10-54.

Farnell

Datasheet1 page17 years ago

Datasheet1 page27 years ago

Datasheet3 pages21 years ago

element14 APAC

Descriptions

Descriptions of Bergquist K10-54 provided by its distributors.

SIL-PAD, K-10, .006", TO-220; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:1.3W/m.K; Breakdown Voltage Vbr:6kV;

element14 APAC

Thermal Pad, To-220; Thermal Conductivity:1.3W/M.k; Thickness:0.152Mm; Thermal Impedance:0.86°C/W; Dielectric Strength:-; Product Range:-; Breakdown Voltage Vbr:6Kv; Insulator Body Material:Pi (Polyimide) Film; Packages Cooled:To-220Rohs Compliant: Yes |Bergquist K10-54

Newark

SIL-PAD, K-10, .006", TO-220; Insulator Body Material: PI (Polyimide) Film; Thermal Conductivity: 1.3W/m.K; Breakdown Voltage Vbr: 6kV; Thickness: 0.152mm; Volume Resistivity: 10ohm-m; Thermal Impedance: 0.86°C/W; Dielectric Strength: -; Product Range: -; SVHC: No SVHC (27-Jun-2018); Electrical Property Ins / Con: Insulative; External Depth: 0.15mm; Isolation Voltage: 6kV; Operating Temperature Max: 180°C; Operating Temperature Min: -60°C; Operating Temperature Range: -60°C to +180°C; Packages Cooled: TO-220; Thermal Resistance: 0.2°C/W; Type: Thermal Pad

Farnell