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Datasheets & Documents
Download datasheets and manufacturer documentation for AMD XCVE2102-2MSISFVA784.
Supply Chain
Harmonized Tariff Schedule (HTS) Code8542.31.00.30
Introduction Date2021-06-08
Lifecycle StatusProduction (Last Updated: 3 months ago)
Descriptions
Descriptions of AMD XCVE2102-2MSISFVA784 provided by its distributors.
SoC FPGA XCVE2102-2MSISFVA784
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
SoC, CMOS, PBGA784
Manufacturer Aliases
AMD has several brands around the world that distributors may use as alternate names. AMD may also be known as the following names:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Technical Specifications
Physical
Case/PackageBGA
Number of Terminals784
Technical
Max Operating Temperature110 °C
Max Supply Voltage825 mV
Min Operating Temperature-40 °C
Min Supply Voltage775 mV
Nominal Supply Voltage (DC)800 mV
Dimensions
Height - Seated (Max)3.66 mm
Length23 mm
Terminal Pitch800 µm
Width23 mm
Datasheets & Documents
Download datasheets and manufacturer documentation for AMD XCVE2102-2MSISFVA784.