AMD XCKU11P-3FFVD900E
$ 5,287.5
Production
Supply Chain
Country of OriginTaiwan
Export Control Classification Number (ECCN) Code3A991.D
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2016-06-03
Lifecycle StatusProduction (Last Updated: 1 month ago)
Descriptions
Descriptions of AMD XCKU11P-3FFVD900E provided by its distributors.
FPGA, Kintex UltraScale+ Series, SRAM, 653100 Logic Cells, 408 I/Os, 900 Pins, FCBGA
Kintex UltraScale FPGA, Speed Grade-3, Logic Cells 653K, D900, RoHS
Xilinx SCT
Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA900
FIAM1 "C" 48V 10A LPG HOLE ROH
Manufacturer Aliases
AMD has several brands around the world that distributors may use as alternate names. AMD may also be known as the following names:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Technical Specifications
Physical
Case/PackageBGA
Number of Terminals900
Technical
Max Operating Temperature100 °C
Max Supply Voltage927 mV
Min Operating Temperature0 °C
Min Supply Voltage873 mV
Number of Inputs512
Number of Logic Blocks (LABs)37320
Number of Logic Elements/Cells653100
Number of Outputs512
Number of Transceivers20
Operating Supply Voltage900 mV
RAM Size2.8 MB
Speed Grade-3
Dimensions
Height - Seated (Max)3.42 mm
Length31 mm
Terminal Pitch1 mm
Width31 mm