대체 부품
이 부품
대체 부품
Price @ 1000
$ 143.066
$ 80.021
$ 80.021
Stock
201,009
172,129
172,129
Authorized Distributors
3
3
3
Case/Package
BGA
BGA
BGA
Number of Pins
357
357
357
Core Architecture
PowerPC
PowerPC
PowerPC
Data Bus Width
32 b
32 b
32 b
Max Frequency
133 MHz
133 MHz
133 MHz
Interface
I2C, SPI, UART
-
-
Min Supply Voltage
1.7 V
1.7 V
1.7 V
Max Supply Voltage
1.9 V
1.9 V
1.9 V
공급망
Country of OriginMalaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2002-11-19
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2020-05-19
LTD Date2020-11-19
관련 부품
NXP SemiconductorsMPC880VR133
MPU MPC8xx RISC 32bit 0.18um 133MHz 3.3V 357-Pin BGA Tray / IC MPU MPC8XX 133MHZ 357BGA
설명
유통업체에서 제공한 NXP Semiconductors MPC866PVR133A에 대한 설명입니다.
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.18um 133MHz 3.3V 357-Pin BGA Tray
FIXED POINT MICROPROCESSOR RISC 1Core 32-Bit BALL IC Microprocessor 0C~95C TA 25mm 1.7V 133MHz
RISC Microprocessor, 32-Bit, 133MHz, CMOS, PBGA357
133MHz L1 CACHE 1 1.9V,3.465V 133MHz 16KB 3.3V HDLC,I2C,IrDA,PCMCIA,SDLC,SPI,TDM,UART,USART 10Mbps,10Mbps,100Mbps 32bit MPC8xx ;CPM BGA
IC, MPU, 32BIT, POWERQUICC, 357PBGA; Series:PowerQUICC I; Core Size:32bit; Program Memory Size:24KB; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; Digital IC Case Style:BGA; No. of Pins:357; CPU Speed:133MHz; Embedded Interface Type:I2C, SPI; Operating Temperature Min:0°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013); Cache on Chip L1/L2 Memory:24KB; Frequency Typ:133MHz; Interface Type:I2C, SPI, UART; No. of Bits:32; No. of I/O's:59; Operating Temperature Range:0°C to +95°C; Package / Case:BGA; Supply Voltage Range:1.7V to 1.9V; Termination Type:SMD
제조업체 별칭
NXP Semiconductors에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. NXP Semiconductors는 다음 이름으로도 알려져 있습니다:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
기술 사양
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins357
Number of Terminals357
Weight2.094208 g
Technical
Core ArchitecturePowerPC
Data Bus Width32 b
Frequency133 MHz
InterfaceI2C, SPI, UART
Max Frequency133 MHz
Max I/O Voltage3.3 V
Max Operating Temperature95 °C
Max Supply Voltage1.9 V
Memory Size24 kB
Min Operating Temperature0 °C
Min Supply Voltage1.7 V
Number of Bits32
Number of Cores1
Number of I/Os59
Operating Supply Voltage1.8 V
RAM Size8 kB
Schedule B8542310000
TerminationSMD/SMT
Dimensions
Height - Seated (Max)2.52 mm
Length25 mm
Terminal Pitch1.27 mm
Width25 mm
규정 준수
환경 분류
China RoHSCompliant
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
규정 준수 정책