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이 부품
대체 부품
Price @ 1000
$ 121.015
$ 35.841
$ 35.841
Stock
191,146
272,158
272,158
Authorized Distributors
2
3
3
Case/Package
BGA
BGA
BGA
Number of Pins
357
357
357
Core Architecture
PowerPC
PowerPC
PowerPC
Data Bus Width
32 b
32 b
32 b
Max Frequency
50 MHz
50 MHz
50 MHz
Interface
-
-
-
Min Supply Voltage
3.135 V
3.135 V
3.135 V
Max Supply Voltage
3.465 V
3.465 V
3.465 V
공급망
Country of OriginMalaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2012-02-10
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2021-12-01
LTD Date2023-12-01
관련 부품
NXP SemiconductorsMPC860DEZQ50D4
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray
NXP SemiconductorsMPC855TVR50D4R2
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 50MHz 357-Pin BGA T/R
NXP SemiconductorsMPC860ENCVR50D4
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray
설명
유통업체에서 제공한 NXP Semiconductors MPC860DEVR50D4에 대한 설명입니다.
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 50MHz 357-Pin BGA Tray
RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, HDLC, PCMCIA, 0 to 95C
POWER QUICC, 860DEVR50, PBGA-357; Series:MPC860; Bits, No. of:32; Frequency, typ:50MHz; Memory, Cache on Chip L1/L2:8KB; Interface type:I2C, SPI, UART; Termination Type:SMD; Case style:PBGA; Temp, op. max:95°C; Temp, op. min:0°C; Base number:860; Frequency, clock:50MHz; IC Generic number:860DEVR50; Logic function number:4; Pins, No. of:357; Qualified Segment:COMMERCIAL, INDUSTRIAL; RAM size:0Byte; Temperature, operating range:0°C to +95°C; Voltage, supply max:3.3V
제조업체 별칭
NXP Semiconductors에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. NXP Semiconductors는 다음 이름으로도 알려져 있습니다:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
기술 사양
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins357
Number of Terminals357
Weight2.096504 g
Technical
Core ArchitecturePowerPC
Data Bus Width32 b
Frequency50 MHz
Max Frequency50 MHz
Max I/O Voltage3.3 V
Max Operating Temperature95 °C
Max Supply Voltage3.465 V
Min Operating Temperature0 °C
Min Supply Voltage3.135 V
Number of Cores1
Operating Supply Voltage3.3 V
RAM Size8 kB
Dimensions
Height - Seated (Max)2.52 mm
Length25 mm
Terminal Pitch1.27 mm
Width25 mm