代替部品
Price @ 1000
$ 48.832
$ 36.303
$ 36.303
Stock
303,654
243,282
243,282
Authorized Distributors
3
4
4
Case/Package
BGA
BGA
BGA
Number of Pins
-
196
196
Core Architecture
Coldfire
Coldfire
Coldfire
Data Bus Width
32 b
32 b
32 b
Max Frequency
66 MHz
66 MHz
66 MHz
Number of I/Os
32
32
32
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
Memory Type
ROM
ROM
ROM
Memory Size
16 kB
16 kB
16 kB
Min Supply Voltage
3 V
3 V
3 V
Max Supply Voltage
3.6 V
3.6 V
3.6 V
Peripherals
DMA, WDT
DMA, WDT
DMA, WDT
サプライチェーン
Country of OriginMainland China, Malaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2002-03-12
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2021-12-01
LTD Date2023-12-01
関連部品
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MCU 32-bit MCF5225x ColdFire RISC 512KB Flash 3.3V Automotive 144-Pin MAP-BGA Tray
NXP SemiconductorsMCF52256CVN66
MCU 32-bit MCF5225x ColdFire RISC 256KB Flash 3.3V Automotive 144-Pin MAP-BGA Tray
説明
NXP Semiconductors MCF5272CVM66の詳細は販売業者から提供されます。
FIXED POINT ROHS3Compliant BALL BOTTOM Microcontroller -40C~85C TA 66MHz 1.75mm 1K x 32
MPU ColdFire MCF5xxx Processor RISC 32-Bit 66MHz 3.3V 196-Pin MAP-BGA Tray
MCF527x Series 16 KB Flash 1 kB SRAM 66 MHz 32-Bit Microcontroller - MAPBGA-196
1 66MHz ROM 1 3V 3.6V 66MHz 1KB 3.3V EBI,EMI,Ethernet,I2C,SPI,UART,USART,USB 10Mbps,100Mbps 32bit Coldfire V2 BGA 15mm*15mm*1.16mm
IC, CPU COLDFIRE 4K SRAM, 5272CVM66; Series:ColdFire V2 MPU; Core Size:32bit; Program Memory Size:1 KB; CPU Speed:66MHz; Digital IC Case Style:MAPBGA; No. of Pins:256; Supply Voltage Range:3V to 3.6V; Operating Temperature Range:-40°C to +85°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2011); Base Number:5272; Cache on Chip L1/L2 Memory:1KB; Clock Frequency:66MHz; EEPROM Memory Size:0Byte; Frequency Typ:66MHz; IC Generic Number:5272CVM66; Interface Type:UART, USB, TDM, QSPI, Ethernet; Logic Function Number:66; Memory Size:0; Memory Type:SRAM; Microprocessor/Controller Features:IEEE 802.3 compliant Ethernet Controller, USB 1.1 device controller and transceiver, 3 PWM outputs, 2 UARTs, 1-channel DMA; No. of Bits:32; No. of I/O's:32; No. of Timers:4; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Package / Case:MAP-BGA; Qualified Segment:COMMERCIAL, INDUSTRIAL; RAM Memory Size:4KB; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:SMD
メーカーの別名
NXP Semiconductorsは世界中でいくつかのブランドを持っており、販売業者が代替名として使用するかもしれません。 NXP Semiconductors は以下の名前でも知られているかもしれません：
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
技術仕様
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Terminals196
Weight482.537233 mg
Technical
Core ArchitectureColdfire
Data Bus Width32 b
Frequency66 MHz
InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
Max Frequency66 MHz
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Memory Size16 kB
Memory TypeROM
Min Operating Temperature-40 °C
Min Supply Voltage3 V
Number of Bits32
Number of I/Os32
Operating Supply Voltage3.3 V
Oscillator TypeExternal
PeripheralsDMA, WDT
RAM Size4 kB
Schedule B8542310000
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.75 mm
Length15 mm
Terminal Pitch1 mm
Width15 mm
コンプライアンス
環境分類
China RoHSCompliant
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
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